PACKAGE MATERIALS INFORMATION
www.ti.com
24-Jul-2013
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
OPA2353EA/250
OPA2353EA/2K5
OPA2353UA/2K5
OPA353UA/2K5
OPA4353EA/250
OPA4353EA/2K5
OPA4353UA/2K5
VSSOP
VSSOP
SOIC
DGK
DGK
D
8
8
250
2500
2500
2500
250
210.0
367.0
367.0
367.0
210.0
367.0
367.0
185.0
367.0
367.0
367.0
185.0
367.0
367.0
35.0
35.0
35.0
35.0
35.0
35.0
38.0
8
SOIC
D
8
SSOP
SSOP
SOIC
DBQ
DBQ
D
16
16
14
2500
2500
Pack Materials-Page 2