PACKAGE MATERIALS INFORMATION
www.ti.com
9-Sep-2013
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
OPA2234U/2K5
OPA2234UA/2K5
OPA234E/250
SOIC
SOIC
D
D
8
8
2500
2500
250
367.0
367.0
210.0
367.0
210.0
367.0
367.0
367.0
367.0
367.0
367.0
367.0
185.0
367.0
185.0
367.0
367.0
367.0
367.0
367.0
35.0
35.0
35.0
35.0
35.0
35.0
35.0
35.0
38.0
38.0
VSSOP
VSSOP
VSSOP
VSSOP
SOIC
DGK
DGK
DGK
DGK
D
8
OPA234E/2K5
OPA234EA/250
OPA234EA/2K5
OPA234U/2K5
OPA234UA/2K5
OPA4234U/2K5
OPA4234UA/2K5
8
2500
250
8
8
2500
2500
2500
2500
2500
8
SOIC
D
8
SOIC
D
14
14
SOIC
D
Pack Materials-Page 2