PACKAGE OPTION ADDENDUM
www.ti.com
4-Jul-2013
Orderable Device
Status Package Type Package Pins Package
Eco Plan Lead/Ball Finish
MSL Peak Temp
Op Temp (°C)
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
OPA4343EA/250G4
OPA4343EA/2K5
OPA4343EA/2K5G4
OPA4343NA/250
OPA4343NA/250G4
OPA4343NA/2K5
OPA4343NA/2K5G4
OPA4343UA
ACTIVE
SSOP
SSOP
SSOP
TSSOP
TSSOP
TSSOP
TSSOP
SOIC
DBQ
16
16
16
14
14
14
14
14
14
14
14
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-2-260C-1 YEAR
OPA
4343EA
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
DBQ
DBQ
PW
PW
PW
PW
D
2500
2500
250
Green (RoHS
& no Sb/Br)
OPA
4343EA
Green (RoHS
& no Sb/Br)
OPA
4343EA
Green (RoHS
& no Sb/Br)
OPA
4343NA
250
Green (RoHS
& no Sb/Br)
OPA
4343NA
2500
2500
50
Green (RoHS
& no Sb/Br)
OPA
4343NA
Green (RoHS
& no Sb/Br)
OPA
4343NA
Green (RoHS
& no Sb/Br)
OPA4343UA
OPA4343UA
OPA4343UA
OPA4343UA
OPA4343UA/2K5
OPA4343UA/2K5G4
OPA4343UAG4
SOIC
D
2500
2500
50
Pb-Free
(RoHS)
SOIC
D
Pb-Free
(RoHS)
SOIC
D
Green (RoHS
& no Sb/Br)
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Addendum-Page 2
TI [ TEXAS INSTRUMENTS ]
