OPA171
OPA2171
OPA4171
SBOS516C –SEPTEMBER 2010–REVISED JUNE 2011
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UNITS
THERMAL INFORMATION: OPA171
OPA171
DBV (SOT23)
5 PINS
245.8
THERMAL METRIC(1)
D (SO)
8 PINS
149.5
97.9
DRL (SOT553)
5 PINS
208.1
0.1
θJA
Junction-to-ambient thermal resistance
Junction-to-case(top) thermal resistance
Junction-to-board thermal resistance
θJC(top)
θJB
133.9
87.7
83.6
42.4
°C/W
ψJT
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Junction-to-case(bottom) thermal resistance
35.5
18.2
0.5
ψJB
89.5
83.1
42.2
θJC(bottom)
N/A
N/A
N/A
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
THERMAL INFORMATION: OPA2171
OPA2171
THERMAL METRIC(1)
D (SO)
8 PINS
134.3
72.1
DCU (VSSOP)
8 PINS
175.2
74.9
DGK (MSOP)
8 PINS
195.3
59.4
UNITS
θJA
Junction-to-ambient thermal resistance
Junction-to-case(top) thermal resistance
Junction-to-board thermal resistance
θJC(top)
θJB
60.6
22.2
115.1
4.7
°C/W
ψJT
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Junction-to-case(bottom) thermal resistance
18.2
1.6
ψJB
53.8
22.8
114.4
N/A
θJC(bottom)
N/A
N/A
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
THERMAL INFORMATION: OPA4171
OPA4171
THERMAL METRIC(1)
D (SO)
14 PINS
93.2
PW (TSSOP)
14 PINS
106.9
24.4
UNITS
θJA
Junction-to-ambient thermal resistance
Junction-to-case(top) thermal resistance
Junction-to-board thermal resistance
θJC(top)
θJB
51.8
49.4
59.3
°C/W
ψJT
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Junction-to-case(bottom) thermal resistance
13.5
0.6
ψJB
42.2
54.3
θJC(bottom)
N/A
N/A
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
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