PACKAGE OPTION ADDENDUM
www.ti.com
5-Jan-2005
PACKAGING INFORMATION
Orderable Device
Status (1)
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
PDIP
PDIP
PDIP
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
PDIP
PDIP
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
PDIP
PDIP
SOIC
SOIC
Drawing
OPA131P
OPA131PA
OBSOLETE
OBSOLETE
OBSOLETE
ACTIVE
P
P
8
8
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
None
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OPA131PJ
P
8
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OPA131U
D
8
100
2500
100
CU SNPB
CU SNPB
CU SNPB
CU SNPB
CU SNPB
CU SNPB
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Level-2-220C-1 YEAR
Level-2-220C-1 YEAR
Level-2-220C-1 YEAR
Level-3-235C-168 HR
Level-3-235C-168 HR
Level-3-235C-168 HR
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OPA131U/2K5
OPA131UA
ACTIVE
D
8
ACTIVE
D
8
OPA131UA/2K5
OPA131UJ
ACTIVE
D
8
2500
100
ACTIVE
D
8
OPA131UJ/2K5
OPA2131PA
OPA2131PJ
OPA2131UA
OPA2131UA/2K5
OPA2131UJ
OPA2131UJ/2K5
OPA4131NA
OPA4131NJ
OPA4131PA
OPA4131PJ
OPA4131UA
OPA4131UA/1K
ACTIVE
D
8
2500
OBSOLETE
OBSOLETE
ACTIVE
P
8
P
8
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D
8
100
2500
100
2500
58
CU SNPB
CU SNPB
CU SNPB
CU SNPB
CU SNPB
CU SNPB
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Level-3-220C-168 HR
Level-3-220C-168 HR
Level-3-220C-168 HR
Level-3-220C-168 HR
Level-3-220C-168 HR
Level-3-235C-168 HR
Level-NA-NA-NA
Level-NA-NA-NA
Level-3-260C-168 HR
Level-3-260C-168 HR
ACTIVE
D
8
ACTIVE
D
8
ACTIVE
D
8
ACTIVE
D
14
14
14
14
16
16
ACTIVE
D
58
ACTIVE
N
25
ACTIVE
N
25
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ACTIVE
DW
DW
48
CU SNPB
CU SNPB
ACTIVE
1000
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - May not be currently available - please check http://www.ti.com/productcontent for the latest availability information and additional
product content details.
None: Not yet available Lead (Pb-Free).
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Green (RoHS & no Sb/Br): TI defines "Green" to mean "Pb-Free" and in addition, uses package materials that do not contain halogens,
including bromine (Br) or antimony (Sb) above 0.1% of total product weight.
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDECindustry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
Addendum-Page 1
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