PACKAGE OPTION ADDENDUM
www.ti.com
4-Sep-2010
PACKAGING INFORMATION
Status (1)
Eco Plan (2)
MSL Peak Temp (3)
Samples
Orderable Device
Package Type Package
Drawing
Pins
Package Qty
Lead/
Ball Finish
(Requires Login)
Samples Not Available
Samples Not Available
Samples Not Available
Samples Not Available
Samples Not Available
Samples Not Available
Purchase Samples
OPA209AID
OPA209AIDBVR
OPA209AIDBVT
OPA209AIDGKR
OPA209AIDGKT
OPA209AIDR
PREVIEW
PREVIEW
PREVIEW
PREVIEW
PREVIEW
PREVIEW
ACTIVE
SOIC
SOT-23
SOT-23
MSOP
MSOP
SOIC
D
8
5
5
8
8
8
8
75
3000
250
2500
250
2500
75
TBD
TBD
TBD
TBD
TBD
TBD
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DBV
DBV
DGK
DGK
D
OPA2209AID
SOIC
D
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-2-260C-1 YEAR
OPA2209AIDGKR
OPA2209AIDGKT
OPA2209AIDR
PREVIEW
PREVIEW
ACTIVE
MSOP
MSOP
SOIC
DGK
DGK
D
8
8
8
2500
250
TBD
TBD
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Samples Not Available
Samples Not Available
Request Free Samples
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-2-260C-1 YEAR
OPA4209AIPW
PREVIEW
PREVIEW
TSSOP
TSSOP
PW
PW
14
14
90
TBD
TBD
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Samples Not Available
Samples Not Available
OPA4209AIPWR
2000
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Addendum-Page 1
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