OP07C, OP07D, OP07Y
PRECISION OPERATIONAL AMPLIFIERS
SLOS099B – OCTOBER 1983 – REVISED AUGUST 1996
OP07Y chip information
These chips, properly assembled, display characteristics similar to the OP07. Thermal compression or
ultrasonic bonding may be used on the doped-aluminum bonding pads. Chips may be mounted with conductive
epoxy or a gold-silicon preform.
BONDING PAD ASSIGNMENTS
OFFSET N1
(8)
(7)
(6)
IN +
IN –
OFFSET N2
(1)
(3)
(2)
(8)
VCC+
(7)
+
–
(4)
VCC –
(6)
OUT
CHIP THICKNESS: 15 TYPICAL
72
BONDING PADS: 4
×
4 MINIMUM
TJmax = 150°C
TOLERANCES ARE
±
10%.
ALL DIMENSIONS ARE IN MILS.
(1)
(2)
(3)
(4)
PIN (4) IS INTERNALLY CONNECTED
TO BACKSIDE OF CHIP.
94
2
POST OFFICE BOX 655303
•
DALLAS, TEXAS 75265
TI [ TEXAS INSTRUMENTS ]
