EXAMPLE STENCIL DESIGN
RSM0032B
VQFN - 1 mm max height
PLASTIC QUAD FLATPACK - NO LEAD
(0.715)
4X ( 1.23)
(R0.05) TYP
25
32
32X (0.55)
1
24
32X (0.2)
(0.715)
(3.85)
33
SYMM
28X (0.4)
17
8
METAL
TYP
16
9
SYMM
(3.85)
SOLDER PASTE EXAMPLE
BASED ON 0.1 mm THICK STENCIL
EXPOSED PAD 33:
77% PRINTED SOLDER COVERAGE BY AREA UNDER PACKAGE
SCALE:20X
4219108/B 08/2019
NOTES: (continued)
6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
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