NE555, NE555Y, SA555, SE555, SE555C
PRECISION TIMERS
SLFS022 – SEPTEMBER 1973 – REVISED FEBRUARY 1992
chip information
These chips, properly assembled, display characteristics similar to the NE555 (see electrical table for NE555Y).
Thermal compression or ultrasonic bonding may be used on the doped aluminum bonding pads. Chips may be
mounted with conductive epoxy or a gold-silicon preform.
BONDING PAD ASSIGNMENTS
CONT
(5)
RESET
(4)
VCC
(8)
THRES
(6)
R
R1
R
S
1
(2)
(3)
(4)
(3)
OUT
R
TRIG
(2)
R
(7)
41
DISCH
(1)
(1)
GND
(5)
(8)
CHIP THICKNESS: 15 TYPICAL
BONDING PADS: 4
×
4 MINIMUM
(6)
(7)
TJ max = 150° C
TOLERANCES ARE
±
10%
42
ALL DIMENSIONS ARE IN MILS
PIN (1) INTERNALLY CONNECTED
TO BACKSIDE OF CHIP
POST OFFICE BOX 655303
•
DALLAS, TEXAS 75265
3
TI [ TEXAS INSTRUMENTS ]
