PACKAGE OPTION ADDENDUM
www.ti.com
18-Feb-2005
PACKAGING INFORMATION
Orderable Device
NE5532AD
NE5532ADR
NE5532AIP
NE5532AP
NE5532APSR
NE5532D
NE5532DR
NE5532IP
NE5532P
NE5532PSR
SA5532AD
SA5532ADR
SA5532AP
SA5532D
SA5532DR
SA5532P
(1)
Status
(1)
ACTIVE
ACTIVE
OBSOLETE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
OBSOLETE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
Package
Type
SOIC
SOIC
PDIP
PDIP
SO
SOIC
SOIC
PDIP
PDIP
SO
SOIC
SOIC
PDIP
SOIC
SOIC
PDIP
Package
Drawing
D
D
P
P
PS
D
D
P
P
PS
D
D
P
D
D
P
Pins Package Eco Plan
(2)
Qty
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
50
2000
75
2500
50
75
2500
50
50
2000
75
2500
75
2500
Pb-Free
(RoHS)
Pb-Free
(RoHS)
None
Pb-Free
(RoHS)
Pb-Free
(RoHS)
Pb-Free
(RoHS)
Pb-Free
(RoHS)
None
Pb-Free
(RoHS)
Pb-Free
(RoHS)
Pb-Free
(RoHS)
Pb-Free
(RoHS)
Pb-Free
(RoHS)
Pb-Free
(RoHS)
Pb-Free
(RoHS)
Pb-Free
(RoHS)
Lead/Ball Finish
CU NIPDAU
CU NIPDAU
Call TI
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
Call TI
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
MSL Peak Temp
(3)
Level-2-250C-1 YEAR
Level-2-250C-1 YEAR
Call TI
Level-NC-NC-NC
Level-2-260C-1 YEAR/
Level-1-235C-UNLIM
Level-2-250C-1 YEAR
Level-2-250C-1 YEAR
Call TI
Level-NC-NC-NC
Level-2-260C-1 YEAR/
Level-1-235C-UNLIM
Level-2-260C-1 YEAR/
Level-1-235C-UNLIM
Level-2-260C-1 YEAR/
Level-1-235C-UNLIM
Level-NC-NC-NC
Level-2-260C-1 YEAR/
Level-1-235C-UNLIM
Level-2-260C-1 YEAR/
Level-1-235C-UNLIM
Level-NC-NC-NC
The marketing status values are defined as follows:
ACTIVE:
Product device recommended for new designs.
LIFEBUY:
TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND:
Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW:
Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE:
TI has discontinued the production of the device.
(2)
Eco Plan - May not be currently available - please check
for the latest availability information and additional
product content details.
None:
Not yet available Lead (Pb-Free).
Pb-Free (RoHS):
TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Green (RoHS & no Sb/Br):
TI defines "Green" to mean "Pb-Free" and in addition, uses package materials that do not contain halogens,
including bromine (Br) or antimony (Sb) above 0.1% of total product weight.
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDECindustry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The
information provided on this page represents TI's knowledge and belief as of the date that it is
Addendum-Page 1
TI [ TEXAS INSTRUMENTS ]
