PACKAGE OPTION ADDENDUM
www.ti.com
22-Mar-2013
PACKAGING INFORMATION
Orderable Device
Status Package Type Package Pins Package Qty
Eco Plan Lead/Ball Finish
MSL Peak Temp
Op Temp (°C)
Top-Side Markings
Samples
Drawing
(1)
(2)
(3)
(4)
MSP430G2755IDA38
MSP430G2755IDA38R
MSP430G2755IRHA40R
MSP430G2755IRHA40T
MSP430G2855IDA38
MSP430G2855IDA38R
MSP430G2855IRHA40R
MSP430G2855IRHA40T
MSP430G2955IDA38
MSP430G2955IDA38R
MSP430G2955IRHA40R
MSP430G2955IRHA40T
ACTIVE
TSSOP
TSSOP
VQFN
DA
38
38
40
40
38
38
40
40
38
38
40
40
40
2000
2500
250
40
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
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G2755
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
DA
RHA
RHA
DA
G2755
G2755
G2755
G2855
G2855
G2855
G2855
G2955
G2955
G2955
G2955
VQFN
TSSOP
TSSOP
VQFN
DA
2000
2500
250
40
RHA
RHA
DA
VQFN
TSSOP
TSSOP
VQFN
DA
1
RHA
RHA
1
VQFN
250
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
Addendum-Page 1
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