MSP430F663x
www.ti.com
SLAS566C –JUNE 2010–REVISED AUGUST 2012
Table 2. Ordering Information(1)
PACKAGED DEVICES(2)
TA
PLASTIC 100-PIN TQFP (PZ)
MSP430F6638IPZ
MSP430F6637IPZ
MSP430F6636IPZ
MSP430F6635IPZ
MSP430F6634IPZ
MSP430F6633IPZ
MSP430F6632IPZ
MSP430F6631IPZ
MSP430F6630IPZ
PLASTIC 113-BALL BGA (ZQW)
MSP430F6638IZQW
MSP430F6637IZQW
MSP430F6636IZQW
MSP430F6635IZQW
MSP430F6634IZQW
MSP430F6633IZQW
MSP430F6632IZQW
MSP430F6631IZQW
MSP430F6630IZQW
–40°C to 85°C
(1) For the most current package and ordering information, see the Package Option Addendum at the end
of this document, or see the TI web site at www.ti.com.
(2) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design
guidelines are available at www.ti.com/package.
Copyright © 2010–2012, Texas Instruments Incorporated
3
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