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MSP-FET430UIF 参数 Datasheet PDF下载

MSP-FET430UIF图片预览
型号: MSP-FET430UIF
PDF下载: 下载PDF文件 查看货源
内容描述: MSP430硬件工具用户指南 [MSP430 Hardware Tools User Guide]
分类和应用:
文件页数/大小: 138 页 / 6499 K
品牌: TI [ TEXAS INSTRUMENTS ]
 浏览型号MSP-FET430UIF的Datasheet PDF文件第80页浏览型号MSP-FET430UIF的Datasheet PDF文件第81页浏览型号MSP-FET430UIF的Datasheet PDF文件第82页浏览型号MSP-FET430UIF的Datasheet PDF文件第83页浏览型号MSP-FET430UIF的Datasheet PDF文件第85页浏览型号MSP-FET430UIF的Datasheet PDF文件第86页浏览型号MSP-FET430UIF的Datasheet PDF文件第87页浏览型号MSP-FET430UIF的Datasheet PDF文件第88页  
MSP-TS430RGC64USB  
www.ti.com  
Table B-18. MSP-TS430RGC64USB Bill of Materials  
No. Per  
Board  
Pos.  
Ref Des  
Description  
DigiKey Part No.  
Comment  
DNP: C1, C2  
1
1.1  
2
C1, C2  
C3, C4  
C6, C7  
0
2
2
12pF, SMD0805  
47pF, SMD0805  
10uF/6.3V, Tantal Size B  
511-1463-2-ND  
C5, C11,  
C13, C14  
3
4
100nF, SMD0805  
311-1245-2-ND  
3.1  
4
C10, C12  
C8  
0
1
1
1
10uF, SMD0805  
DNP: C10, C12  
2.2nF, SMD0805  
470nF, SMD0805  
green LED, SMD0805  
5
C9  
478-1403-2-ND  
P516TR-ND  
6
D1  
DNP: headers and  
receptacles enclosed with kit.  
Keep vias free of solder.  
7
J1, J2, J3, J4  
J5  
4
16-pin header, TH  
SAM1029-16-ND  
SAM1213-16-ND  
SAM1035-03-ND  
: Header  
: Receptacle  
8
9
1
6
3-pin header, male, TH  
3-pin header, male, TH  
JP5, JP6,  
JP7, JP8,  
JP9, JP10  
SAM1035-03-ND  
place jumpers on pins 2-3  
JP1, JP2,  
JP4  
10  
11  
3
1
2-pin header, male, TH  
3-pin header, male, TH  
SAM1035-02-ND  
SAM1035-03-ND  
place jumper on header  
place jumper on pins 1-2  
JP3  
Place on: JP1, JP2, JP3,  
JP4, JP5, JP6, JP7, JP8,  
JP9, JP10  
12  
13  
14  
10  
1
Jumper  
15-38-1024-ND  
HRP14H-ND  
JTAG  
Q1  
14-pin connector, male, TH  
Crystal  
Q1: Micro Crystal MS1V-T1K  
32.768kHz, C(Load) =  
12.5pF  
DNP: Q1  
Keep vias free of solder"  
0
15  
16  
Q2  
1
2
Crystal  
Q2: 4MHz Buerklin: 78D134  
541-330ATR-ND  
R3, R7  
330 Ω, SMD0805  
R1, R2, R4,  
R6, R8, R9,  
R12  
17  
2
0 Ω, SMD0805  
541-000ATR-ND  
Buerklin: 07E500  
DNP: R4, R6, R8, R9, R12  
18  
18  
18  
19  
20  
R10  
R11  
R5  
1
1
1
1
1
100 Ω, SMD0805  
1M Ω, SMD0805  
47k Ω, SMD0805  
Socket: QFN11T064-006  
79 x 77 mm  
541-47000ATR-ND  
U1  
Manuf.: Yamaichi  
2 layers  
PCB  
Rubber stand  
off  
apply to corners at bottom  
side  
21  
22  
4
2
Buerklin: 20H1724  
DNP: enclosed with kit. Is  
supplied by TI  
MSP430  
MSP430F5509 RGC  
Insulating disk to Q2  
http://www.ettinger.de/Art_De  
tail.cfm?ART_ARTNUM=70.0  
8.121  
Insulating  
disk to Q2  
23  
1
27  
28  
29  
30  
31  
32  
33  
C33  
C35  
1
1
1
1
1
1
3
220n SMD0603  
10p SMD0603  
10p SMD0603  
220n SMD0603  
4u7 SMD0603  
0.1u SMD0603  
LL103A  
Buerklin: 53D2074  
Buerklin: 56D102  
Buerklin: 56D102  
Buerklin: 53D2074  
Buerklin: 53D2086  
Buerklin: 53D2068  
Buerklin: 24S3406  
C36  
C38  
C39  
C40  
D2, D3, D4  
84  
Hardware  
SLAU278FMay 2009Revised December 2010  
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© 2009–2010, Texas Instruments Incorporated  
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