PACKAGE MATERIALS INFORMATION
www.ti.com
14-Aug-2009
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
MAX3232CDBR
MAX3232CDR
MAX3232CDWR
MAX3232CPWR
MAX3232IDBR
MAX3232IDR
SSOP
SOIC
DB
D
16
16
16
16
16
16
16
16
2000
2500
2000
2000
2000
2500
2000
2000
330.0
330.0
330.0
330.0
330.0
330.0
330.0
330.0
16.4
16.4
16.4
12.4
16.4
16.4
16.4
12.4
8.2
6.5
6.6
2.5
2.1
2.7
1.6
2.5
2.1
2.7
1.6
12.0
8.0
16.0
16.0
16.0
12.0
16.0
16.0
16.0
12.0
Q1
Q1
Q1
Q1
Q1
Q1
Q1
Q1
10.3
SOIC
DW
PW
DB
D
10.75 10.7
12.0
8.0
TSSOP
SSOP
SOIC
7.0
8.2
6.5
5.6
6.6
12.0
8.0
10.3
MAX3232IDWR
MAX3232IPWR
SOIC
DW
PW
10.75 10.7
7.0 5.6
12.0
8.0
TSSOP
Pack Materials-Page 1