PACKAGE OPTION ADDENDUM
www.ti.com
28-Feb-2005
PACKAGING INFORMATION
Orderable Device
Status (1)
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
SSOP
SSOP
Drawing
SN74LVC245ADBLE
SN74LVC245ADBR
OBSOLETE
ACTIVE
DB
20
20
None
Call TI
Call TI
DB
2000
2000
25
Pb-Free
(RoHS)
CU NIPDAU Level-2-260C-1 YEAR/
Level-1-235C-UNLIM
SN74LVC245ADGVR
SN74LVC245ADW
SN74LVC245ADWR
ACTIVE
ACTIVE
ACTIVE
TVSOP
SOIC
DGV
DW
20
20
20
Pb-Free
(RoHS)
CU NIPDAU Level-1-250C-UNLIM
Pb-Free
(RoHS)
CU NIPDAU Level-2-250C-1 YEAR/
Level-1-235C-UNLIM
SOIC
DW
2000
Pb-Free
(RoHS)
CU NIPDAU Level-2-250C-1 YEAR/
Level-1-235C-UNLIM
SN74LVC245AGQNR
SN74LVC245AN
ACTIVE
ACTIVE
VFBGA
PDIP
GQN
N
20
20
1000
20
None
SNPB
Level-1-240C-UNLIM
Pb-Free
(RoHS)
CU NIPDAU Level-NC-NC-NC
SN74LVC245ANSR
SN74LVC245APW
ACTIVE
ACTIVE
SO
NS
20
20
2000
Pb-Free
(RoHS)
CU NIPDAU Level-2-260C-1 YEAR/
Level-1-235C-UNLIM
TSSOP
PW
70 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74LVC245APWLE
SN74LVC245APWR
OBSOLETE TSSOP
PW
PW
20
20
None
Call TI
Call TI
ACTIVE
ACTIVE
ACTIVE
ACTIVE
TSSOP
TSSOP
QFN
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74LVC245APWT
SN74LVC245ARGYR
SN74LVC245AZQNR
PW
RGY
ZQN
20
20
20
250
Pb-Free
(RoHS)
CU NIPDAU Level-1-250C-UNLIM
1000 Green (RoHS & CU NIPDAU Level-2-260C-1YEAR
no Sb/Br)
VFBGA
1000
Pb-Free
(RoHS)
SNAGCU
Level-1-260C-UNLIM
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - May not be currently available - please check http://www.ti.com/productcontent for the latest availability information and additional
product content details.
None: Not yet available Lead (Pb-Free).
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Green (RoHS & no Sb/Br): TI defines "Green" to mean "Pb-Free" and in addition, uses package materials that do not contain halogens,
including bromine (Br) or antimony (Sb) above 0.1% of total product weight.
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDECindustry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
Addendum-Page 1
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