LP2950-N, LP2951-N
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SNVS764Q –JANUARY 2000–REVISED DECEMBER 2017
7 Specifications
7.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)(1)(2)
MIN
–0.3
–1.5
MAX
30
UNIT
V
Input supply voltage - SHUTDOWN input voltage error comparator output voltage(3)
FEEDBACK input voltage(3)(4)
30
V
Power dissipation
Internally Limited
150
Junction temperature, TJ
Wave
4 seconds, 260
10 seconds, 240
75 seconds, 219
150
°C
°C
Soldering dwell time, temperature
Infrared
Vapor phase
Storage temperature, Tstg
–65
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) If Military/Aerospace specified devices are required, contact the Texas Instruments Sales Office/Distributors for availability and
specifications.
(3) May exceed input supply voltage.
(4) When used in dual-supply systems where the output terminal sees loads returned to a negative supply, the output voltage should be
diode-clamped to ground.
7.2 ESD Ratings
VALUE
UNIT
LP2950-N
Electrostatic
discharge
LP2951-N
V(ESD)
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)
±2500
V
IN, OUT, GND, ERROR
SHUTDOWN
±2500
±2000
±1500
±1000
Electrostatic
discharge
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-
001(1)
V(ESD)
V
SENSE
VTAP, FEEDBACK
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
7.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)(1)
MIN
MAX
30
UNIT
V
Maximum input supply voltage
LP2950AC-XX, LP2950C-XX
LP2951
–40
–55
–40
125
150
125
°C
(2)
Junction temperature, TJ
°C
LP2951AC-XX, LP2951C-XX
°C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) The junction-to-ambient thermal resistances are as follows: 157.4°C/W for the TO-92 (LP) package, 51.3°C/W for the TO-252 (NDP)
package, 56.3°C/W for the molded PDIP (P), 117.7°C/W for the molded plastic SOIC (D), 171°C/W for the molded plastic VSSOP
(DGK). The above thermal resistances for the P, D, and DGK packages apply when the package is soldered directly to the PCB. The
value of RθJA for the WSON (NGT) package is typically 43.3°C/W but is dependent on the PCB trace area, trace material, and the
number of layers and thermal vias. For details of thermal resistance and power dissipation for the WSON package, see AN-1187
Leadless Leadframe Package (LLP).
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