PACKAGE MATERIALS INFORMATION
www.ti.com
5-Dec-2017
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
LP2951ACSDX/NOPB
LP2951CMM
WSON
VSSOP
VSSOP
VSSOP
VSSOP
VSSOP
VSSOP
VSSOP
VSSOP
SOIC
NGT
DGK
DGK
DGK
DGK
DGK
DGK
DGK
DGK
D
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
4500
1000
1000
1000
1000
3500
3500
3500
3500
2500
2500
2500
2500
1000
1000
1000
4500
4500
367.0
210.0
210.0
210.0
210.0
367.0
367.0
367.0
367.0
367.0
367.0
367.0
367.0
203.0
210.0
203.0
367.0
346.0
367.0
185.0
185.0
185.0
185.0
367.0
367.0
367.0
367.0
367.0
367.0
367.0
367.0
203.0
185.0
203.0
367.0
346.0
35.0
35.0
35.0
35.0
35.0
35.0
35.0
35.0
35.0
35.0
35.0
35.0
35.0
35.0
35.0
35.0
35.0
35.0
LP2951CMM-3.0/NOPB
LP2951CMM-3.3/NOPB
LP2951CMM/NOPB
LP2951CMMX
LP2951CMMX-3.0/NOPB
LP2951CMMX-3.3/NOPB
LP2951CMMX/NOPB
LP2951CMX
LP2951CMX-3.0/NOPB
LP2951CMX-3.3/NOPB
LP2951CMX/NOPB
LP2951CSD-3.0/NOPB
LP2951CSD-3.3/NOPB
LP2951CSD/NOPB
LP2951CSDX-3.3/NOPB
LP2951CSDX/NOPB
SOIC
D
SOIC
D
SOIC
D
WSON
WSON
WSON
WSON
WSON
NGT
NGT
NGT
NGT
NGT
Pack Materials-Page 4