PACKAGE MATERIALS INFORMATION
www.ti.com
29-May-2013
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
LP2950CDTX-3.0/NOPB
LP2950CDTX-3.3/NOPB
LP2950CDTX-5.0
TO-252
TO-252
TO-252
TO-252
VSSOP
VSSOP
VSSOP
VSSOP
VSSOP
VSSOP
VSSOP
VSSOP
VSSOP
VSSOP
VSSOP
VSSOP
SOIC
NDP
NDP
NDP
NDP
DGK
DGK
DGK
DGK
DGK
DGK
DGK
DGK
DGK
DGK
DGK
DGK
D
3
3
3
3
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
2500
2500
2500
2500
1000
1000
1000
1000
1000
1000
3500
3500
3500
3500
3500
3500
2500
2500
2500
2500
367.0
367.0
367.0
367.0
210.0
210.0
210.0
210.0
210.0
210.0
367.0
367.0
367.0
367.0
367.0
367.0
367.0
367.0
367.0
367.0
367.0
367.0
367.0
367.0
185.0
185.0
185.0
185.0
185.0
185.0
367.0
367.0
367.0
367.0
367.0
367.0
367.0
367.0
367.0
367.0
38.0
38.0
35.0
38.0
35.0
35.0
35.0
35.0
35.0
35.0
35.0
35.0
35.0
35.0
35.0
35.0
35.0
35.0
35.0
35.0
LP2950CDTX-5.0/NOPB
LP2951ACMM
LP2951ACMM-3.0
LP2951ACMM-3.0/NOPB
LP2951ACMM-3.3
LP2951ACMM-3.3/NOPB
LP2951ACMM/NOPB
LP2951ACMMX
LP2951ACMMX-3.0
LP2951ACMMX-3.0/NOPB
LP2951ACMMX-3.3
LP2951ACMMX-3.3/NOPB
LP2951ACMMX/NOPB
LP2951ACMX
LP2951ACMX-3.0
SOIC
D
LP2951ACMX-3.0/NOPB
LP2951ACMX-3.3
SOIC
D
SOIC
D
Pack Materials-Page 3