PACKAGE MATERIALS INFORMATION
www.ti.com
8-May-2013
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
LMV321M7/NOPB
LMV321M7X
SC70
SC70
DCK
DCK
DCK
DBV
DBV
DBV
DBV
PW
PW
D
5
5
1000
3000
3000
1000
3000
1000
3000
2500
2500
2500
2500
2500
2500
1000
1000
3500
3500
2500
2500
2500
1000
3500
2500
1000
3500
210.0
210.0
210.0
210.0
210.0
210.0
210.0
367.0
367.0
367.0
367.0
349.0
349.0
210.0
210.0
367.0
367.0
367.0
367.0
367.0
210.0
367.0
367.0
210.0
367.0
185.0
185.0
185.0
185.0
185.0
185.0
185.0
367.0
367.0
367.0
367.0
337.0
337.0
185.0
185.0
367.0
367.0
367.0
367.0
367.0
185.0
367.0
367.0
185.0
367.0
35.0
35.0
35.0
35.0
35.0
35.0
35.0
35.0
35.0
35.0
35.0
45.0
45.0
35.0
35.0
35.0
35.0
35.0
35.0
35.0
35.0
35.0
35.0
35.0
35.0
LMV321M7X/NOPB
LMV321Q1M5/NOPB
LMV321Q1M5X/NOPB
LMV321Q3M5/NOPB
LMV321Q3M5X/NOPB
LMV324MTX
SC70
5
SOT-23
SOT-23
SOT-23
SOT-23
TSSOP
TSSOP
SOIC
5
5
5
5
14
14
14
14
14
14
8
LMV324MTX/NOPB
LMV324MX
LMV324MX/NOPB
LMV324Q1MAX/NOPB
LMV324Q3MAX/NOPB
LMV358MM
SOIC
D
SOIC
D
SOIC
D
VSSOP
VSSOP
VSSOP
VSSOP
SOIC
DGK
DGK
DGK
DGK
D
LMV358MM/NOPB
LMV358MMX
8
8
LMV358MMX/NOPB
LMV358MX
8
8
LMV358MX/NOPB
LMV358Q1MAX/NOPB
LMV358Q1MM/NOPB
LMV358Q1MMX/NOPB
LMV358Q3MAX/NOPB
LMV358Q3MM/NOPB
LMV358Q3MMX/NOPB
SOIC
D
8
SOIC
D
8
VSSOP
VSSOP
SOIC
DGK
DGK
D
8
8
8
VSSOP
VSSOP
DGK
DGK
8
8
Pack Materials-Page 3