PACKAGE OPTION ADDENDUM
www.ti.com
9-May-2013
Orderable Device
Status Package Type Package Pins Package
Eco Plan Lead/Ball Finish
MSL Peak Temp
Op Temp (°C)
Top-Side Markings
Samples
Drawing
Qty
(1)
(2)
(3)
(4)
LMV324MX
ACTIVE
SOIC
SOIC
D
14
14
2500
TBD
Call TI
CU SN
Call TI
-40 to 85
-40 to 85
LMV324M
LMV324MX/NOPB
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
D
D
2500
55
Green (RoHS
& no Sb/Br)
Level-1-260C-UNLIM
LMV324M
LMV324Q1MA/NOPB
LMV324Q1MAX/NOPB
LMV324Q1MT/NOPB
LMV324Q1MTX/NOPB
LMV324Q3MA/NOPB
LMV324Q3MAX/NOPB
LMV324Q3MT/NOPB
LMV324Q3MTX/NOPB
LMV358M
SOIC
SOIC
14
14
14
14
14
14
14
14
8
Green (RoHS
& no Sb/Br)
CU SN
CU SN
CU SN
CU SN
CU SN
CU SN
CU SN
CU SN
Call TI
CU SN
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Call TI
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
LMV324Q1
MA
D
2500
94
Green (RoHS
& no Sb/Br)
LMV324Q1
MA
TSSOP
TSSOP
SOIC
PW
PW
D
Green (RoHS
& no Sb/Br)
LMV324
Q1MT
2500
55
Green (RoHS
& no Sb/Br)
LMV324
Q1MT
Green (RoHS
& no Sb/Br)
LMV324Q3
MA
SOIC
D
2500
94
Green (RoHS
& no Sb/Br)
LMV324Q3
MA
TSSOP
TSSOP
SOIC
PW
PW
D
Green (RoHS
& no Sb/Br)
LMV324
Q3MT
2500
95
Green (RoHS
& no Sb/Br)
LMV324
Q3MT
TBD
LMV
358M
LMV358M/NOPB
SOIC
D
8
95
Green (RoHS
& no Sb/Br)
Level-1-260C-UNLIM
LMV
358M
LMV358MM
ACTIVE
ACTIVE
VSSOP
VSSOP
DGK
DGK
8
8
1000
1000
TBD
Call TI
CU SN
Call TI
-40 to 85
-40 to 85
V358
LMV358MM/NOPB
Green (RoHS
& no Sb/Br)
Level-1-260C-UNLIM
V358
LMV358MMX
ACTIVE
ACTIVE
VSSOP
VSSOP
DGK
DGK
8
8
3500
3500
TBD
Call TI
CU SN
Call TI
-40 to 85
-40 to 85
V358
V358
LMV358MMX/NOPB
Green (RoHS
& no Sb/Br)
Level-1-260C-UNLIM
LMV358MX
ACTIVE
ACTIVE
SOIC
SOIC
D
D
8
8
2500
2500
TBD
Call TI
CU SN
Call TI
-40 to 85
-40 to 85
LMV
358M
LMV358MX/NOPB
Green (RoHS
& no Sb/Br)
Level-1-260C-UNLIM
LMV
358M
Addendum-Page 2
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