SNOS012I – AUGUST 2000 – REVISED FEBRUARY 2013
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
Absolute Maximum Ratings
ESD Tolerance
(3)
(1) (2)
Human Body Model
LMV358-N/LMV324-N
LMV321-N
Machine Model
Differential Input Voltage
Input Voltage
Supply Voltage (V –V )
Output Short Circuit to V
+
Output Short Circuit to V
−
Soldering Information
Infrared or Convection (30 sec)
Storage Temp. Range
Junction Temperature
(1)
(2)
(3)
(4)
(5)
(6)
(6)
+
−
2000V
900V
100V
±Supply Voltage
−0.3V
to +Supply Voltage
5.5V
(4)
(5)
260°C
−65°C
to 150°C
150°C
Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is intended to be functional, but specific performance is not guaranteed. For guaranteed specifications and the test
conditions, see the Electrical Characteristics.
If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office / Distributors for
availability and specifications.
Human Body Model, applicable std. MIL-STD-883, Method 3015.7. Machine Model, applicable std. JESD22-A115-A (ESD MM std. of
JEDEC)Field-Induced Charge-Device Model, applicable std. JESD22-C101-C (ESD FICDM std. of JEDEC
Shorting output to V
+
will adversely affect reliability.
Shorting output to V
-
will adversely affect reliability.
The maximum power dissipation is a function of T
J(MAX)
,
θ
JA
. The maximum allowable power dissipation at any ambient temperature is
P
D
= (T
J(MAX)
– T
A
)/
θ
JA
. All numbers apply for packages soldered directly onto a PC Board.
(1)
Operating Ratings
Supply Voltage
Temperature Range
(2)
2.7V to 5.5V
−40°C
to +125°C
478°C/W
265°C/W
190°C/W
235°C/W
145°C/W
155°C/W
LMV321-N/LMV358-N/LMV324-N
Thermal Resistance (θ
JA
)
5-pin SC70
5-pin SOT23
8-Pin SOIC
8-Pin MSOP
14-Pin SOIC
14-Pin TSSOP
(1)
(2)
(3)
(3)
Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is intended to be functional, but specific performance is not guaranteed. For guaranteed specifications and the test
conditions, see the Electrical Characteristics.
The maximum power dissipation is a function of T
J(MAX)
,
θ
JA
. The maximum allowable power dissipation at any ambient temperature is
P
D
= (T
J(MAX)
– T
A
)/
θ
JA
. All numbers apply for packages soldered directly onto a PC Board.
All numbers are typical, and apply for packages soldered directly onto a PC board in still air.
2
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