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LMV358IDR 参数 Datasheet PDF下载

LMV358IDR图片预览
型号: LMV358IDR
PDF下载: 下载PDF文件 查看货源
内容描述: 低电压轨到轨输出运算放大器 [LOW-VOLTAGE RAIL-TO-RAIL OUTPUT OPERATIONAL AMPLIFIERS]
分类和应用: 运算放大器放大器电路光电二极管输出元件PC
文件页数/大小: 45 页 / 1618 K
品牌: TI [ TEXAS INSTRUMENTS ]
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LMV321 SINGLE, LMV358 DUAL
LMV324 QUAD, LMV324S QUAD WITH SHUTDOWN
SLOS263U – AUGUST 1999 – REVISED JULY 2012
LOW-VOLTAGE RAIL-TO-RAIL OUTPUT OPERATIONAL AMPLIFIERS
Check for Samples:
1
FEATURES
2.7-V and 5-V Performance
–40°C to 125°C Operation
Low-Power Shutdown Mode (LMV324S)
No Crossover Distortion
Low Supply Current
– LMV321 . . . 130
μA
Typ
– LMV358 . . . 210
μA
Typ
– LMV324 . . . 410
μA
Typ
– LMV324S . . . 410
μA
Typ
Rail-to-Rail Output Swing
ESD Protection Exceeds JESD 22
– 2000-V Human-Body Model (A114-A)
– 1000-V Charged-Device Model (C101)
LMV324 . . . D (SOIC) OR PW (TSSOP) PACKAGE
(TOP VIEW)
1OUT
1IN–
1IN+
V
CC+
2IN+
2IN–
2OUT
1
2
3
4
5
6
7
14
13
12
11
10
9
8
4OUT
4IN–
4IN+
GND
3IN+
3IN–
3OUT
LMV324S . . . D (SOIC) OR PW (TSSOP) PACKAGE
(TOP VIEW)
DESCRIPTION/
ORDERING INFORMATION
The LMV321, LMV358, and LMV324/LMV324S are
single, dual, and quad low-voltage (2.7 V to 5.5 V)
operational amplifiers with rail-to-rail output swing.
The LMV324S, which is a variation of the standard
LMV324, includes a power-saving shutdown feature
that reduces supply current to a maximum of 5
μA
per channel when the amplifiers are not needed.
Channels 1 and 2 together are put in shutdown, as
are channels 3 and 4. While in shutdown, the outputs
actively are pulled low.
The LMV321, LMV358, LMV324, and LMV324S are
the most cost-effective solutions for applications
where low-voltage operation, space saving, and low
cost are needed. These amplifiers are designed
specifically for low-voltage (2.7 V to 5 V) operation,
with performance specifications meeting or exceeding
the LM358 and LM324 devices that operate from 5 V
to 30 V. Additional features of the LMV3xx devices
are a common-mode input voltage range that
includes ground, 1-MHz unity-gain bandwidth, and 1-
V/μs slew rate.
The LMV321 is available in the ultra-small DCK (SC-
70) package, which is approximately one-half the size
of the DBV (SOT-23) package. This package saves
space on printed circuit boards and enables the
design of small portable electronic devices. It also
allows the designer to place the device closer to the
signal source to reduce noise pickup and increase
signal integrity.
1
1OUT
1IN–
1IN+
V
CC
2IN+
2IN–
2OUT
1/2 SHDN
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
4OUT
4IN–
4IN+
GND
3IN+
3IN–
3OUT
3/4 SHDN
LMV358 . . . D (SOIC), DDU (VSSOP),
DGK (MSOP), OR PW (TSSOP) PACKAGE
(TOP VIEW)
1OUT
1IN–
1IN+
GND
1
2
3
4
8
7
6
5
V
CC+
2OUT
2IN–
2IN+
LMV321 . . . DBV (SOT-23) OR DCK (SC-70) PACKAGE
(TOP VIEW)
1IN+
GND
1IN–
1
2
3
5
V
CC+
OUT
4
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 1999–2012, Texas Instruments Incorporated