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LMV358IDR 参数 Datasheet PDF下载

LMV358IDR图片预览
型号: LMV358IDR
PDF下载: 下载PDF文件 查看货源
内容描述: 低电压轨到轨输出运算放大器 [LOW-VOLTAGE RAIL-TO-RAIL OUTPUT OPERATIONAL AMPLIFIERS]
分类和应用: 运算放大器放大器电路光电二极管输出元件PC
文件页数/大小: 32 页 / 929 K
品牌: TI [ TEXAS INSTRUMENTS ]
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LMV321 SINGLE, LMV358 DUAL, LMV324 QUAD, LMV324S QUAD WITH SHUTDOWN
LOW VOLTAGE RAIL TO RAIL OUTPUT OPERATIONAL AMPLIFIERS
SLOS263R − AUGUST 1999 − REVISED APRIL 2005
D
D
D
D
D
D
D
2.7-V and 5-V Performance
−405C to 1255C Operation
Low-Power Shutdown Mode (LMV324S)
No Crossover Distortion
Low Supply Current
− LMV321 . . . 130
µA
Typ
− LMV358 . . . 210
µA
Typ
− LMV324 . . . 410
µA
Typ
− LMV324S . . . 410
µA
Typ
Rail-to-Rail Output Swing
ESD Protection Exceeds JESD 22
− 2000-V Human-Body Model (A114-A)
− 1000-V Charged-Device Model (C101)
LMV324 . . . D (SOIC) OR PW (TSSOP) PACKAGE
(TOP VIEW)
1OUT
1IN−
1IN+
V
CC+
2IN+
2IN−
2OUT
1
2
3
4
5
6
7
14
13
12
11
10
9
8
4OUT
4IN−
4IN+
GND
3IN+
3IN−
3OUT
LMV324S . . . D (SOIC) OR PW (TSSOP) PACKAGE
(TOP VIEW)
description/ordering information
The LMV321, LMV358, and LMV324/LMV324S
are single, dual, and quad low-voltage (2.7 V to
5.5 V), operational amplifiers with rail-to-rail
output swing. The LMV324S, which is a variation
of the standard LMV324, includes a power-saving
shutdown feature that reduces supply current to a
maximum of 5
µA
per channel when the amplifiers
are not needed. Channels 1 and 2 together are put
in shutdown, as are channels 3 and 4. While in
shutdown, the outputs actively are pulled low.
The LMV321, LMV358, LMV324, and LMV324S
are the most cost-effective solutions for
applications where low-voltage operation, space
saving, and low cost are needed. These amplifiers
were designed specifically for low-voltage (2.7 V
to 5 V) operation, with performance specifications
meeting or exceeding the LM358 and LM324
devices that operate from 5 V to 30 V. Additional
features of the LMV3xx devices are a
common-mode input voltage range that includes
ground, 1-MHz unity-gain bandwidth, and 1-V/µs
slew rate.
The LMV321 is available in the ultra-small DCK
(SC-70) package, which is approximately
one-half the size of the DBV (SOT-23) package.
This package saves space on printed circuit
boards and enables the design of small portable
electronic devices. It also allows the designer to
place the device closer to the signal source to
reduce noise pickup and increase signal integrity.
1OUT
1IN−
1IN+
V
CC
2IN+
2IN−
2OUT
1/2 SHDN
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
4OUT
4IN−
4IN+
GND
3IN+
3IN−
3OUT
3/4 SHDN
LMV358 . . . D (SOIC), DDU (VSSOP),
DGK (MSOP), OR PW (TSSOP PACKAGE
(TOP VIEW)
1OUT
1IN−
1IN+
GND
1
2
3
4
8
7
6
5
V
CC+
2OUT
2IN−
2IN+
LMV321 . . . DBV (SOT-23) OR DCK (SC-70) PACKAGE
(TOP VIEW)
1IN+
GND
1IN−
1
2
3
5
V
CC+
OUT
4
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
Copyright
2005, Texas Instruments Incorporated
POST OFFICE BOX 655303
DALLAS, TEXAS 75265
1