PACKAGE MATERIALS INFORMATION
www.ti.com
23-Sep-2013
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
LMH6642MAX/NOPB
LMH6642MF
SOIC
SOT-23
SOT-23
SOT-23
SOIC
D
DBV
DBV
DBV
D
8
5
2500
1000
1000
3000
2500
2500
2500
2500
367.0
210.0
210.0
210.0
367.0
367.0
367.0
367.0
367.0
185.0
185.0
185.0
367.0
367.0
367.0
367.0
35.0
35.0
35.0
35.0
35.0
35.0
35.0
35.0
LMH6642MF/NOPB
LMH6642MFX/NOPB
LMH6643MAX
5
5
8
LMH6643MAX/NOPB
LMH6644MAX/NOPB
LMH6644MTX/NOPB
SOIC
D
8
SOIC
D
14
14
TSSOP
PW
Pack Materials-Page 2