LMH6642, LMH6643, LMH6644
SNOS966P –MAY 2001–REVISED MARCH 2013
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Closed Loop Gain vs. Frequency for Various Gain
Large Signal Frequency Response
8.0
6.0
4.0
2.0
0.0
+3
+2
+1
0
±2.5V
V
= ±1.5V
= 2k
S
A
V
= +1
2V
PP
R
L
±5V
V
= 0.2V
PP
OUT
4V
PP
-1
-2
-3
A
V
= +10
A
= +5
V
A
= +2
V
R
= R = 2k
L
F
A
= +2
V
100k
1M
10M
200M
10k
100k
1M
10M
100M 500M
FREQUENCY (Hz)
FREQUENCY (Hz)
Figure 1.
Figure 2.
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
(1)(2)
Absolute Maximum Ratings
(3)
ESD Tolerance
2KV
200V
(4)
(5)
1000V
VIN Differential
±2.5V
(6) (7)
Output Short Circuit Duration
Supply Voltage (V+ - V−)
Voltage at Input/Output pins
Input Current
See
,
13.5V
V+ +0.8V, V− −0.8V
±10mA
Storage Temperature Range
−65°C to +150°C
+150°C
(8)
Junction Temperature
Soldering Information
Infrared or Convection Reflow (20 sec)
Wave Soldering Lead Temp.(10 sec)
235°C
260°C
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is intended to be functional, but specific performance is not guaranteed. For guaranteed specifications and the test
conditions, see the Electrical Characteristics.
(2) If Military/Aerospace specified devices are required, please contact the TI Sales Office/Distributors for availability and specifications.
(3) Human body model, 1.5kΩ in series with 100pF.
(4) Machine Model, 0Ω in series with 200pF.
(5) CDM: Charge Device Model
(6) Applies to both single-supply and split-supply operation. Continuous short circuit operation at elevated ambient temperature can result in
exceeding the maximum allowed junction temperature of 150°C.
(7) Output short circuit duration is infinite for VS < 6V at room temperature and below. For VS > 6V, allowable short circuit duration is 1.5ms.
(8) The maximum power dissipation is a function of TJ(MAX), θJA, and TA. The maximum allowable power dissipation at any ambient
temperature is PD = (TJ(MAX) - TA)/ θJA . All numbers apply for packages soldered directly onto a PC board.
2
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