PACKAGE OUTLINE
RTW0024A
WQFN - 0.8 mm max height
S
C
A
L
E
3
.
0
0
0
PLASTIC QUAD FLATPACK - NO LEAD
4.1
3.9
B
A
PIN 1 INDEX AREA
4.1
3.9
C
0.8 MAX
SEATING PLANE
0.08 C
0.05
0.00
2X 2.5
(0.1) TYP
EXPOSED
THERMAL PAD
7
12
20X 0.5
6
13
2X
25
2.5
2.6 0.1
1
18
0.3
24X
0.2
24
19
PIN 1 ID
(OPTIONAL)
0.1
C A B
C
0.05
0.5
0.3
24X
4222815/A 03/2016
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance.
www.ti.com
TI [ TEXAS INSTRUMENTS ]
