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LMH0324RTWR 参数 Datasheet PDF下载

LMH0324RTWR图片预览
型号: LMH0324RTWR
PDF下载: 下载PDF文件 查看货源
内容描述: [3G HD/SD 低功耗 SDI 自适应电缆均衡器 | RTW | 24 | -40 to 85]
分类和应用:
文件页数/大小: 40 页 / 1286 K
品牌: TI [ TEXAS INSTRUMENTS ]
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LMH0324  
ZHCSIC8B APRIL 2016REVISED JUNE 2018  
www.ti.com.cn  
9 Power Supply Recommendations  
The LMH0324 is designed to provide flexibility in supply rails. There are two ways to power the LMH0324:  
Single 2.5 V Supply Mode: This mode offers ease of use and pin compatibility with the LMH1219 (11.88  
Gbps Ultra-HD Adaptive Cable Equalizer with Integrated Reclocker). The internal circuitry receives power  
from the on-chip 1.8 V regulator. In this mode, 2.5 V is applied to VIN, VDDIO, and RSV_L. This mode  
supports SPI or SMBus serial interface. See 24 for more details.  
Single 1.8 V Supply Mode: This mode provides the lowest power consumption. In this mode, 1.8 V is  
connected to VIN, VDD_LDO and VDDIO. RSV_L is tied to VSS. In this mode, SPI is supported, but SMBus  
serial interface is not. In Single 1.8 V Supply Mode, the LMH0324 is not drop-in compatible with the  
LMH1219. See 25 for more details.  
2.5 V  
1 µF  
10 µF  
0.1 µF  
0.1 µF  
0.1 µF  
RSV_L  
VDDIO  
VIN  
Internal LDO  
2.5 V to 1.8 V  
EP  
VSS  
VSS  
VSS  
VDD_LDO (1.8 V)  
1 µF  
0.1 µF  
24. Single 2.5 V Supply Mode - Compatible with LMH1219  
1.8 V  
0.1 µF  
10 µF  
1.8 V  
1 µF  
0.1 µF  
RSV_L  
VDDIO  
VIN  
VDD_LDO  
EP  
VSS  
VSS  
VSS  
1 µF  
0.1 µF  
25. Single 1.8 V Supply Mode - Not Compatible with LMH1219  
For power supply de-coupling, 0.1-μF surface-mount ceramic capacitors are recommended to be placed close to  
each supply pin to VSS. Larger bulk capacitors (for example, 10 µF and 1 µF) are recommended to be placed  
close to each LMH0324 device. Good supply bypassing requires low inductance capacitors. This can be  
achieved through an array of multiple small body size surface-mount bypass capacitors in order to keep low  
supply impedance. Better results can be achieved through the use of a buried capacitor formed by a VDD and  
VSS plane separated by 2-4 mil dielectric in a printed circuit board.  
30  
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