LMC6482
SNOS674D –NOVEMBER 1997–REVISED MARCH 2013
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Connection Diagram
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
Absolute Maximum Ratings(1)(2)
(3)
ESD Tolerance
1.5kV
±Supply Voltage
(V+) +0.3V, (V−) −0.3V
16V
Differential Input Voltage
Voltage at Input/Output Pin
Supply Voltage (V+ − V−)
(4)
Current at Input Pin
±5mA
(5) (6)
Current at Output Pin
±30mA
Current at Power Supply Pin
Lead Temperature (Soldering, 10 sec.)
Storage Temperature Range
40mA
260°C
−65°C to +150°C
150°C
(7)
Junction Temperature
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is intended to be functional, but specific performance is not ensured. For ensured specifications and the test
conditions, see the Electrical Characteristics.
(2) If Military/Aerospace specified devices are required, please contact the TI Sales Office/Distributors for availability and specifications.
(3) Human body model, 1.5kΩ in series with 100pF. All pins rated per method 3015.6 of MIL-STD-883. This is a Class 1 device rating.
(4) Limiting input pin current is only necessary for input voltages that exceed absolute maximum input voltage ratings.
(5) Applies to both single-supply and split-supply operation. Continuous short circuit operation at elevated ambient temperature can result in
exceeding the maximum allowed junction temperature of 150°C. Output currents in excess of ±30mA over long term may adversely
affect reliability.
(6) Do not short circuit output to V+, when V+ is greater than 13V or reliability will be adversely affected.
(7) The maximum power dissipation is a function of TJ(max), θJA, and TA. The maximum allowable power dissipation at any ambient
temperature is PD = (TJ(max) − TA)/θJA. All numbers apply for packages soldered directly into a PC board.
Operating Ratings
Supply Voltage
3.0V ≤ V+ ≤ 15.5V
Junction Temperature Range
LMC6482AM
−55°C ≤ TJ ≤ +125°C
−40°C ≤ TJ ≤ +85°C
LMC6482AI, LMC6482I
Thermal Resistance (θJA
)
P0008E Package, 8-Pin PDIP
D0008A Package, 8-Pin SOIC
DGK0008A Package, 8-Pin VSSOP
90°C/W
155°C/W
194°C/W
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is intended to be functional, but specific performance is not ensured. For ensured specifications and the test
conditions, see the Electrical Characteristics.
2
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