PACKAGE MATERIALS INFORMATION
www.ti.com
26-Mar-2013
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
LMC6482AIMX
LMC6482AIMX/NOPB
LMC6482IMM
SOIC
SOIC
D
D
8
8
8
8
8
8
8
8
2500
2500
1000
1000
3500
3500
2500
2500
367.0
367.0
210.0
210.0
367.0
367.0
367.0
367.0
367.0
367.0
185.0
185.0
367.0
367.0
367.0
367.0
35.0
35.0
35.0
35.0
35.0
35.0
35.0
35.0
VSSOP
VSSOP
VSSOP
VSSOP
SOIC
DGK
DGK
DGK
DGK
D
LMC6482IMM/NOPB
LMC6482IMMX
LMC6482IMMX/NOPB
LMC6482IMX
LMC6482IMX/NOPB
SOIC
D
Pack Materials-Page 2