PACKAGE MATERIALS INFORMATION
www.ti.com
24-Apr-2013
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
LM78L05ACMX
LM78L05ACMX/NOPB
LM78L05AIMX/NOPB
LM78L05ITP/NOPB
LM78L05ITPX/NOPB
LM78L09ITPX/NOPB
LM78L12ACMX
SOIC
SOIC
D
D
8
8
8
8
8
8
8
8
8
8
2500
2500
2500
250
367.0
367.0
367.0
210.0
210.0
210.0
367.0
367.0
367.0
367.0
367.0
367.0
367.0
185.0
185.0
185.0
367.0
367.0
367.0
367.0
35.0
35.0
35.0
35.0
35.0
35.0
35.0
35.0
35.0
35.0
SOIC
D
DSBGA
DSBGA
DSBGA
SOIC
YPB
YPB
YPB
D
3000
3000
2500
2500
2500
2500
LM78L12ACMX/NOPB
LM78L15ACMX
SOIC
D
SOIC
D
LM78L15ACMX/NOPB
SOIC
D
Pack Materials-Page 2
TI [ TEXAS INSTRUMENTS ]
