LM340-N, LM78xx
SNOSBT0I –FEBRUARY 2000–REVISED MARCH 2013
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SOT-223
DDPAK/TO-263
ΔIQ = 1.3 mA over line and load changes.
Figure 3. Current Regulator
Figure 4. Comparison between SOT-223 and
DDPAK/TO-263 Packages
Scale 1:1
Connection Diagrams
Figure 5. DDPAK/TO-263 Surface-Mount Package
Top View
Figure 6. 3-Lead SOT-223
Top View
See Package Number DCY
See Package Number KTT0003B
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
Absolute Maximum Ratings(1)(2)(3)
DC Input Voltage
35V
Internally Limited
150°C
Internal Power Dissipation(4)
Maximum Junction Temperature
Storage Temperature Range
Lead Temperature (Soldering, 10 sec.)
−65°C to +150°C
300°C
TO-3 Package (NDS)
TO-220 Package (NDE), DDPAK/TO-263
Package (KTT)
230°C
2 kV
ESD Susceptibility(5)
(1) Absolute Maximum Ratings are limits beyond which damage to the device may occur. Operating Conditions are conditions under which
the device functions but the specifications might not be ensured. For ensured specifications and test conditions see the Electrical
Characteristics.
(2) Military datasheets are available upon request. At the time of printing, the military datasheet specifications for the LM140K-5.0/883,
LM140K-12/883, and LM140K-15/883 complied with the min and max limits for the respective versions of the LM140. The LM140H and
LM140K may also be procured as JAN devices on slash sheet JM38510/107.
(3) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and
specifications.
(4) The maximum allowable power dissipation at any ambient temperature is a function of the maximum junction temperature for operation
(TJMAX = 125°C or 150°C), the junction-to-ambient thermal resistance (θJA), and the ambient temperature (TA). PDMAX = (TJMAX
−
TA)/θJA. If this dissipation is exceeded, the die temperature will rise above TJMAX and the electrical specifications do not apply. If the die
temperature rises above 150°C, the device will go into thermal shutdown. For the TO-3 package (NDS), the junction-to-ambient thermal
resistance (θJA) is 39°C/W. When using a heatsink, θJA is the sum of the 4°C/W junction-to-case thermal resistance (θJC) of the TO-3
package and the case-to-ambient thermal resistance of the heatsink. For the TO-220 package (NDE), θJA is 54°C/W and θJC is 4°C/W. If
SOT-223 is used, the junction-to-ambient thermal resistance is 174°C/W and can be reduced by a heatsink (see Applications Hints on
heatsinking).If the DDPAK\TO-263 package is used, the thermal resistance can be reduced by increasing the PC board copper area
thermally connected to the package: Using 0.5 square inches of copper area, θJA is 50°C/W; with 1 square inch of copper area, θJAis
37°C/W; and with 1.6 or more inches of copper area, θJA is 32°C/W.
(5) ESD rating is based on the human body model, 100 pF discharged through 1.5 kΩ.
Operating Conditions(1)
(1) Absolute Maximum Ratings are limits beyond which damage to the device may occur. Operating Conditions are conditions under which
the device functions but the specifications might not be ensured. For ensured specifications and test conditions see the Electrical
Characteristics.
2
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