PACKAGE OPTION ADDENDUM
www.ti.com
11-Apr-2013
PACKAGING INFORMATION
Orderable Device
LM555CM
Status Package Type Package Pins Package
Eco Plan Lead/Ball Finish
MSL Peak Temp
Op Temp (°C)
0 to 70
Top-Side Markings
Samples
Drawing
Qty
(1)
(2)
(3)
(4)
ACTIVE
SOIC
SOIC
D
8
8
95
TBD
Call TI
CU SN
Call TI
LM
555CM
LM555CM/NOPB
ACTIVE
D
95
Green (RoHS
& no Sb/Br)
Level-1-260C-UNLIM
0 to 70
LM
555CM
LM555CMM
ACTIVE
ACTIVE
VSSOP
VSSOP
DGK
DGK
8
8
1000
1000
TBD
Call TI
CU SN
Call TI
0 to 70
0 to 70
Z55
LM555CMM/NOPB
Green (RoHS
& no Sb/Br)
Level-1-260C-UNLIM
Z55
LM555CMMX/NOPB
LM555CMX
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
VSSOP
SOIC
SOIC
PDIP
PDIP
PDIP
PDIP
DGK
D
8
8
8
8
8
8
8
3500
2500
2500
40
Green (RoHS
& no Sb/Br)
CU SN
Call TI
CU SN
Call TI
SN
Level-1-260C-UNLIM
Call TI
0 to 70
0 to 70
0 to 70
0 to 70
0 to 70
0 to 70
0 to 70
Z55
TBD
LM
555CM
LM555CMX/NOPB
LM555CN
D
Green (RoHS
& no Sb/Br)
Level-1-260C-UNLIM
Call TI
LM
555CM
P
TBD
LM
555CN
LM555CN/NOPB
MC1455P1
P
40
Green (RoHS
& no Sb/Br)
Level-1-NA-UNLIM
Call TI
LM
555CN
P
40
TBD
Call TI
Call TI
LM
555CN
NE555V
P
40
TBD
Call TI
LM
555CN
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Addendum-Page 1
TI [ TEXAS INSTRUMENTS ]
