SNOS633H – OCTOBER 2000 – REVISED APRIL 2013
R8C (SOT-23 only)
R0C (SOT-23 only)
RJD
R2D
RKD
R4D
R5D
R8D (SOT-23 only)
R0D (SOT-23 only)
RJE
R2E
RKE
Reference, 8.192V, ±0.5%
Reference, 10.000V, ±0.5%
Reference, 2.048V, ±1.0%
Reference, 2.500V, ±1.0%
Reference, 3.000V, ±1.0%
Reference, 4.096V, ±1.0%
Reference, 5.000V, ±1.0%
Reference, 8.192V, ±1.0%
Reference, 10.000V, ±1.0%
Reference, 2.048V, ±2.0%
Reference, 2.500V, ±2.0%
Reference, 3.000V, ±2.0%
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
Absolute Maximum Ratings
(1) (2)
Reverse Current
Forward Current
Power Dissipation (T
A
= 25°C)
(3)
20 mA
10 mA
SOT-23 (M3) Package
TO-92 (Z) Package
SC70 (M7) Package
306 mW
550 mW
241 mW
−65°C
to +150°C
SOT-23 (M3) Package Peak Reflow (30 sec)
TO-92 (Z) Package Soldering (10 sec)
SC70 (M7) Package Peak Reflow (30 sec)
+260°C
+260°C
+260°C
2 kV
200V
Storage Temperature
Soldering Temperature
(4)
ESD Susceptibility
Human Body Model
Machine Model
(5)
(5)
(1)
(2)
(3)
(4)
(5)
Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is functional, but do not ensure specific performance limits. For ensured specifications and test conditions, see the
Electrical Characteristics. The ensured specifications apply only for the test conditions listed. Some performance characteristics may
degrade when the device is not operated under the listed test conditions.
If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and
specifications.
The maximum power dissipation must be derated at elevated temperatures and is dictated by T
Jmax
(maximum junction temperature),
θ
JA
(junction to ambient thermal resistance), and T
A
(ambient temperature). The maximum allowable power dissipation at any
temperature is PD
max
= (T
Jmax
−
T
A
)/θ
JA
or the number given in the Absolute Maximum Ratings, whichever is lower. For the LM4040-N,
T
Jmax
= 125°C, and the typical thermal resistance (θ
JA
), when board mounted, is 326°C/W for the SOT-23 package, and 180°C/W with
0.4″ lead length and 170°C/W with 0.125″ lead length for the TO-92 package and 415°C/W for the SC70 Package.
For definitions of Peak Reflow Temperatures for Surface Mount devices, see the TI
Absolute Maximum Ratings for Soldering Application
Report
The human body model is a 100 pF capacitor discharged through a 1.5 kΩ resistor into each pin. The machine model is a 200 pF
capacitor discharged directly into each pin.
Copyright © 2000–2013, Texas Instruments Incorporated
3
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