LM185-2.5-N, LM285-2.5-N, LM385-2.5-N
SNVS743D –DECEMBER 1999–REVISED MARCH 2013
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Figure 4. LCCC Leadless Chip Carrier
See Package Number NAJ0020A
Figure 5. TO Package
(Bottom View)
See Package Number NDU0002A
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
ABSOLUTE MAXIMUM RATINGS(1)(2)(3)
Reverse Current
30 mA
10 mA
Forward Current
LM185-2.5-N
LM285-2.5-N
LM385-2.5-N
−55°C to + 125°C
−40°C to + 85°C
0°C to 70°C
2kV
Operating Temperature Range(4)
ESD Susceptibility(5)
Storage Temperature
−55°C to + 150°C
260°C
TO-92 Package (10 sec.)
TO Package (10 sec.)
300°C
Soldering Information
Vapor Phase (60 sec.)
Infrared (15 sec.)
215°C
SOIC and SOT-23 Package
220°C
See http://www.ti.com for other methods of soldering surface mount devices.
(1) Refer to RETS185H-2.5 for military specifications.
(2) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is intended to be functional, but do not ensure specific performance limits. For ensured specifications and test
conditions, see the Electrical Characteristics. The ensured specifications apply only for the test conditions listed.
(3) If Military/Aerospace specified devices are required, please contact the TI Sales Office/Distributors for availability and specifications.
(4) For elevated temperature operation, TJ MAX is:
LM185-N: 150°C
LM285-N: 125°C
LM385-N: 100°C
See THERMAL CHARACTERISTICS.
(5) The human body model is a 100 pF capacitor discharged through a 1.5 kΩ resistor into each pin.
THERMAL CHARACTERISTICS
over operating free-air temperature range (unless otherwise noted)
LM185
LM285
150°C
125°C
100°C
TO
Thermal Resistance
SOIC-8
SOT-23
LM385
TO-92
θja (Junction to Ambient)
θjc (Junction to Case)
180°C/W (0.4″ Leads)
170°C/W (0.125″ Leads)
N/A
440°C/W
165°C/W
N/A
283°C/W
N/A
80°C/W
2
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