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LM35 参数 Datasheet PDF下载

LM35图片预览
型号: LM35
PDF下载: 下载PDF文件 查看货源
内容描述: LM35精密摄氏温度传感器 [LM35 Precision Centigrade Temperature Sensors]
分类和应用: 传感器温度传感器
文件页数/大小: 15 页 / 348 K
品牌: TI [ TEXAS INSTRUMENTS ]
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Electrical Characteristics  
(Notes 1, 6)  
LM35  
Tested  
Limit  
LM35C, LM35D  
Tested  
Parameter  
Conditions  
Design  
Limit  
Design  
Limit  
Units  
Typical  
Typical  
Limit  
(Max.)  
(Note 4)  
(Note 5)  
(Note 4)  
(Note 5)  
±
±
±
±
±
±
±
±
±
±
±
±
±
±
Accuracy,  
T A=+25˚C  
0.4  
0.5  
0.8  
0.8  
1.0  
1.5  
0.4  
0.5  
0.8  
0.8  
0.6  
0.9  
0.9  
0.2  
1.0  
˚C  
˚C  
˚C  
˚C  
˚C  
˚C  
˚C  
˚C  
±
±
±
LM35, LM35C  
(Note 7)  
T
T
T
T
A=−10˚C  
1.5  
1.5  
2.0  
±
A=TMAX  
A=TMIN  
A=+25˚C  
±
1.5  
±
Accuracy, LM35D  
(Note 7)  
1.5  
±
±
±
TA=TMAX  
TA=TMIN  
2.0  
2.0  
0.5  
±
±
Nonlinearity  
T
MINTATMAX  
0.3  
0.5  
(Note 8)  
Sensor Gain  
(Average Slope)  
Load Regulation  
(Note 3) 0IL1 mA  
Line Regulation  
(Note 3)  
T
MINTATMAX  
+10.0  
+9.8,  
+10.0  
+9.8,  
mV/˚C  
+10.2  
+10.2  
±
±
±
±
±
T
T
T
A=+25˚C  
0.4  
2.0  
0.4  
2.0  
0.1  
mV/mA  
mV/mA  
mV/V  
mV/V  
µA  
±
±
±
±
±
±
MINTATMAX  
A=+25˚C  
0.5  
5.0  
0.2  
0.5  
5.0  
0.2  
±
±
±
0.01  
0.02  
56  
0.1  
0.01  
0.02  
56  
±
±
4VV S30V  
Quiescent Current  
(Note 9)  
V
V
V
V
S=+5V, +25˚C  
S=+5V  
80  
82  
80  
82  
105  
56.2  
105.5  
0.2  
158  
161  
3.0  
91  
138  
141  
3.0  
µA  
S=+30V, +25˚C  
S=+30V  
56.2  
91.5  
0.2  
µA  
µA  
Change of  
4VVS30V, +25˚C  
4VV S30V  
2.0  
2.0  
µA  
Quiescent Current  
(Note 3)  
0.5  
0.5  
µA  
Temperature  
+0.39  
+0.7  
+0.39  
+0.7  
µA/˚C  
Coefficient of  
Quiescent Current  
Minimum Temperature  
for Rated Accuracy  
Long Term Stability  
In circuit of  
+1.5  
+2.0  
+1.5  
+2.0  
˚C  
˚C  
Figure 1, IL=0  
±
±
0.08  
T
J=TMAX, for  
1000 hours  
0.08  
Note 1: Unless otherwise noted, these specifications apply: −55˚CT +150˚C for the LM35 and LM35A; −40˚T +110˚C for the LM35C and LM35CA; and  
J
J
T +100˚C for the LM35D. V =+5Vdc and I  
=50 µA, in the circuit of Figure 2. These specifications also apply from +2˚C to T  
in the circuit of Figure 1.  
MAX  
J
S
LOAD  
Specifications in boldface apply over the full rated temperature range.  
Note 2: Thermal resistance of the TO-46 package is 400˚C/W, junction to ambient, and 24˚C/W junction to case. Thermal resistance of the TO-92 package is  
180˚C/W junction to ambient. Thermal resistance of the small outline molded package is 220˚C/W junction to ambient. Thermal resistance of the TO-220 package  
is 90˚C/W junction to ambient. For additional thermal resistance information see table in the Applications section.  
Note 3: Regulation is measured at constant junction temperature, using pulse testing with a low duty cycle. Changes in output due to heating effects can be  
computed by multiplying the internal dissipation by the thermal resistance.  
Note 4: Tested Limits are guaranteed and 100% tested in production.  
Note 5: Design Limits are guaranteed (but not 100% production tested) over the indicated temperature and supply voltage ranges. These limits are not used to  
calculate outgoing quality levels.  
Note 6: Specifications in boldface apply over the full rated temperature range.  
Note 7: Accuracy is defined as the error between the output voltage and 10mv/˚C times the device’s case temperature, at specified conditions of voltage, current,  
and temperature (expressed in ˚C).  
Note 8: Nonlinearity is defined as the deviation of the output-voltage-versus-temperature curve from the best-fit straight line, over the device’s rated temperature  
range.  
Note 9: Quiescent current is defined in the circuit of Figure 1.  
Note 10: Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. DC and AC electrical specifications do not apply when operating  
the device beyond its rated operating conditions. See Note 1.  
Note 11: Human body model, 100 pF discharged through a 1.5 kresistor.  
Note 12: See AN-450 “Surface Mounting Methods and Their Effect on Product Reliability” or the section titled “Surface Mount” found in a current National  
Semiconductor Linear Data Book for other methods of soldering surface mount devices.  
www.national.com  
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