PACKAGE OPTION ADDENDUM
www.ti.com
27-Jun-2013
Orderable Device
Status Package Type Package Pins Package
Eco Plan Lead/Ball Finish
MSL Peak Temp
Op Temp (°C)
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
LM35DT/NOPB
ACTIVE
TO-220
NEB
3
45
Green (RoHS
& no Sb/Br)
CU SN
Level-1-NA-UNLIM
0 to 100
LM35DT
LM35DZ
OBSOLETE
ACTIVE
TO-92
TO-92
LP
LP
3
3
TBD
Call TI
SNCU
Call TI
LM35DZ/LFT1
2000
Green (RoHS
& no Sb/Br)
Level-1-NA-UNLIM
LM35
DZ
LM35DZ/LFT2
LM35DZ/LFT4
ACTIVE
ACTIVE
TO-92
TO-92
LP
LP
3
3
2000
2000
TBD
Call TI
SNCU
Call TI
Green (RoHS
& no Sb/Br)
Level-1-NA-UNLIM
LM35
DZ
LM35DZ/LFT7
LM35DZ/NOPB
ACTIVE
ACTIVE
TO-92
TO-92
LP
LP
3
3
2000
1800
Green (RoHS
& no Sb/Br)
SNCU
SNCU
Call TI
Level-1-NA-UNLIM
Level-1-NA-UNLIM
LM35
DZ
Green (RoHS
& no Sb/Br)
0 to 100
LM35
DZ
LM35H
ACTIVE
ACTIVE
TO
TO
NDV
NDV
3
3
1000
1000
TBD
Call TI
-55 to 150
-55 to 150
LM35H
LM35H/NOPB
Green (RoHS POST-PLATE
& no Sb/Br)
Level-1-NA-UNLIM
LM35H
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
Addendum-Page 2
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