PACKAGE MATERIALS INFORMATION
www.ti.com
20-Nov-2013
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
LM258ADGKR
LM258ADGKR
LM258ADR
VSSOP
VSSOP
SOIC
DGK
DGK
D
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
2500
2500
2500
2500
2500
2500
2500
2500
2500
2500
2500
2000
2000
2500
2500
2500
2500
2500
2500
2500
332.0
364.0
340.5
367.0
367.0
364.0
332.0
367.0
364.0
367.0
340.5
367.0
367.0
332.0
364.0
367.0
340.5
364.0
340.5
367.0
358.0
364.0
338.1
367.0
367.0
364.0
358.0
367.0
364.0
367.0
338.1
367.0
367.0
358.0
364.0
367.0
338.1
364.0
338.1
367.0
35.0
27.0
20.6
35.0
35.0
27.0
35.0
35.0
27.0
35.0
20.6
35.0
35.0
35.0
27.0
35.0
20.6
27.0
20.6
35.0
LM258ADR
SOIC
D
LM258ADRG4
LM258DGKR
LM258DGKR
LM258DR
SOIC
D
VSSOP
VSSOP
SOIC
DGK
DGK
D
LM258DRG3
LM258DRG4
LM258DRG4
LM2904AVQPWR
LM2904AVQPWRG4
LM2904DGKR
LM2904DGKR
LM2904DR
SOIC
D
SOIC
D
SOIC
D
TSSOP
TSSOP
VSSOP
VSSOP
SOIC
PW
PW
DGK
DGK
D
LM2904DR
SOIC
D
LM2904DRG3
LM2904DRG4
LM2904DRG4
SOIC
D
SOIC
D
SOIC
D
Pack Materials-Page 3