SLCS006S – OCTOBER 1979 – REVISED AUGUST 2012
ABSOLUTE MAXIMUM RATINGS
(1)
over operating free-air temperature range (unless otherwise noted)
MIN
V
CC
V
ID
V
I
V
O
I
O
Supply voltage
(2)
(3)
MAX
36
±36
UNIT
V
V
V
V
mA
Differential input voltage
Output voltage
Output current
Input voltage range (either input)
–0.3
36
36
20
Duration of output short circuit to ground
(4)
Unlimited
D package
DB package
86
96
80
76
113
5.61
15.05
14.65
150
FK package
J package
–65
260
300
150
°C
°C
°C
°C
°C/W
°C/W
θ
JA
Package thermal impedance, junction to free air
(5) (6)
N package
NS package
PW package
FK package
θ
JC
T
J
Package thermal impedance, junction to case
Operating virtual-junction temperature
Case temperature for 60 s
(7) (8)
J package
W package
Lead temperature 1,6 mm (1/16 in) from case for 60 s
T
stg
(1)
(2)
(3)
(4)
(5)
(6)
(7)
(8)
Storage temperature range
Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
All voltage values, except differential voltages, are with respect to network ground.
Differential voltages are at IN+ with respect to IN–.
Short circuits from outputs to V
CC
can cause excessive heating and eventual destruction.
Maximum power dissipation is a function of T
J
(max),
θ
JA
, and T
A
. The maximum allowable power dissipation at any allowable ambient
temperature is P
D
= (T
J
(max) – T
A
)/θ
JA
. Operating at the absolute maximum T
J
of 150°C can affect reliability.
The package thermal impedance is calculated in accordance with JESD 51-7.
Maximum power dissipation is a function of T
J
(max),
θ
JC
, and T
C
. The maximum allowable power dissipation at any allowable case
temperature is P
D
= (T
J
(max) – T
C
)/θ
JC
. Operating at the absolute maximum T
J
of 150°C can affect reliability.
The package thermal impedance is calculated in accordance with MIL-STD-883.
4
Copyright © 1979–2012, Texas Instruments Incorporated
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