PACKAGE OPTION ADDENDUM
www.ti.com
21-Nov-2006
Orderable Device
LM339DRG4
LM339N
LM339NE4
LM339NSLE
LM339NSR
LM339NSRG4
LM339PW
LM339PWE4
LM339PWG4
LM339PWLE
LM339PWR
LM339PWRE4
LM339PWRG4
LM339Y
(1)
Status
(1)
ACTIVE
ACTIVE
ACTIVE
OBSOLETE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
OBSOLETE
ACTIVE
ACTIVE
ACTIVE
OBSOLETE
Package
Type
SOIC
PDIP
PDIP
SO
SO
SO
TSSOP
TSSOP
TSSOP
TSSOP
TSSOP
TSSOP
TSSOP
Package
Drawing
D
N
N
NS
NS
NS
PW
PW
PW
PW
PW
PW
PW
Pins Package Eco Plan
(2)
Qty
14
14
14
14
14
14
14
14
14
14
14
14
14
0
2500 Green (RoHS &
no Sb/Br)
25
25
Pb-Free
(RoHS)
Pb-Free
(RoHS)
TBD
2000 Green (RoHS &
no Sb/Br)
2000 Green (RoHS &
no Sb/Br)
90
90
90
Green (RoHS &
no Sb/Br)
Green (RoHS &
no Sb/Br)
Green (RoHS &
no Sb/Br)
TBD
2000 Green (RoHS &
no Sb/Br)
2000 Green (RoHS &
no Sb/Br)
2000 Green (RoHS &
no Sb/Br)
TBD
Lead/Ball Finish
CU NIPDAU
CU NIPDAU
CU NIPDAU
Call TI
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
Call TI
CU NIPDAU
CU NIPDAU
CU NIPDAU
Call TI
MSL Peak Temp
(3)
Level-1-260C-UNLIM
N / A for Pkg Type
N / A for Pkg Type
Call TI
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Call TI
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Call TI
The marketing status values are defined as follows:
ACTIVE:
Product device recommended for new designs.
LIFEBUY:
TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND:
Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW:
Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE:
TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
for the latest availability information and additional product content details.
TBD:
The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS):
TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt):
This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br):
TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The
information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
Addendum-Page 4
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