PACKAGE OPTION ADDENDUM
www.ti.com
11-Apr-2013
PACKAGING INFORMATION
Orderable Device
LM137H
Status Package Type Package Pins Package
Eco Plan Lead/Ball Finish
MSL Peak Temp
Op Temp (°C)
-55 to 150
-55 to 150
-40 to 125
-40 to 125
Top-Side Markings
Samples
Drawing
Qty
(1)
(2)
(3)
(4)
ACTIVE
TO
TO
TO
TO
NDT
3
3
3
3
500
Green (RoHS POST-PLATE
& no Sb/Br)
Level-1-NA-UNLIM
Level-1-NA-UNLIM
Level-1-NA-UNLIM
Level-1-NA-UNLIM
LM137HP+
LM137H/NOPB
LM337H
ACTIVE
ACTIVE
ACTIVE
NDT
NDT
NDT
500
500
500
Green (RoHS POST-PLATE
& no Sb/Br)
LM137HP+
LM337H
Green (RoHS POST-PLATE
& no Sb/Br)
LM337H/NOPB
Green (RoHS POST-PLATE
& no Sb/Br)
LM337H
LM337IMP
ACTIVE
ACTIVE
SOT-223
SOT-223
DCY
DCY
4
4
1000
1000
TBD
Call TI
Call TI
-40 to 125
-40 to 125
N02A
N02A
LM337IMP/NOPB
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
LM337IMPX
ACTIVE
ACTIVE
SOT-223
SOT-223
DCY
DCY
4
4
2000
2000
TBD
Call TI
CU SN
Call TI
-40 to 125
-40 to 125
N02A
N02A
LM337IMPX/NOPB
Green (RoHS
& no Sb/Br)
Level-1-260C-UNLIM
LM337T
ACTIVE
ACTIVE
TO-220
TO-220
NDE
NDG
3
3
45
45
TBD
Call TI
CU SN
Call TI
-40 to 125
LM337T P+
LM337T P+
LM337T/LF01
Pb-Free (RoHS
Exempt)
Level-3-245C-168 HR
LM337T/NOPB
ACTIVE
TO-220
NDE
3
45
Pb-Free (RoHS
Exempt)
CU SN
Level-1-NA-UNLIM
-40 to 125
LM337T P+
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Addendum-Page 1
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