LM134, LM234, LM334
SNVS746E –MARCH 2000–REVISED MAY 2013
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These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
Absolute Maximum Ratings(1)(2)
V+ to V− Forward Voltage
LM134/LM234/LM334
LM234-3/LM234-6
40V
30V
V+ to V− Reverse Voltage
R Pin to V− Voltage
Set Current
20V
5V
10 mA
Power Dissipation
400 mW
2000V
ESD Susceptibility(3)
Operating Temperature Range(4)
LM134
−55°C to +125°C
−25°C to +100°C
0°C to +70°C
260°C
LM234/LM234-3/LM234-6
LM334
Soldering Information
TO-92 Package (10 sec.)
TO Package (10 sec.)
SOIC Package
300°C
Vapor Phase (60 sec.)
Infrared (15 sec.)
215°C
220°C
(1) “Absolute Maximum Ratings” indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is functional, but do not ensure specific performance limits.
(2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and
specifications.
(3) Human body model, 100pF discharged through a 1.5kΩ resistor.
(4) For elevated temperature operation, TJ max is:
LM134
LM234
LM334
150°C
125°C
100°C
See Thermal Characteristics.
Thermal Characteristics
over operating free-air temperature range (unless otherwise noted)
Thermal Resistance
TO-92
180°C/W (0.4″ leads)
160°C/W (0.125″ leads)
N/A
TO
SOIC-8
θja (Junction to Ambient)
440°C/W
165°C/W
θjc (Junction to Case)
32°C/W
80°C/W
2
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