LM124, LM124A, LM224, LM224A
LM324, LM324A, LM324Y, LM2902, LM2902Q
QUADRUPLE OPERATIONAL AMPLIFIERS
SLOS066E– SEPTEMBER 1975 – REVISED FEBRUARY1997
LM324Y chip information
This chip, when properly assembled, displays characteristics similar to the LM324. Thermal compression or
ultrasonic bonding may be used on the doped-aluminum bonding pads. Chips may be mounted with conductive
epoxy or a gold-silicon preform.
BONDING PAD ASSIGNMENTS
V
CC+
(4)
(1)
(14)
(3)
(2)
1IN+
(13)
(12)
(1)
(5)
(2)
(3)
1OUT
2IN+
1IN–
2OUT
3IN+
(7)
(6)
(8)
(10)
2IN–
3OUT
(9)
3IN–
(12)
(13)
4IN+
4IN–
(14)
4OUT
(11)
GND
62
(11)
(10)
(4)
(5)
CHIP THICKNESS: 15 TYPICAL
BONDING PADS: 4 × 4 MINIMUM
T max = 150°C
J
(6)
(9)
TOLERANCES ARE ± 10%.
(7)
(8)
ALL DIMENSIONS ARE IN MILS.
65
PIN (11) IS INTERNALLY CONNECTED
TO BACKSIDE OF CHIP.
3–3
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
TI [ TEXAS INSTRUMENTS ]
