PACKAGE MATERIALS INFORMATION
www.ti.com
8-Apr-2013
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
LM2902MTX
LM2902MTX/NOPB
LM2902MX
TSSOP
TSSOP
SOIC
PW
PW
D
14
14
14
14
14
14
14
14
14
14
2500
2500
2500
2500
2500
2500
2500
2500
2500
2500
367.0
367.0
367.0
367.0
367.0
367.0
367.0
367.0
367.0
367.0
367.0
367.0
367.0
367.0
367.0
367.0
367.0
367.0
367.0
367.0
35.0
35.0
35.0
35.0
35.0
35.0
35.0
35.0
35.0
35.0
LM2902MX/NOPB
LM324AMX
SOIC
D
SOIC
D
LM324AMX/NOPB
LM324MTX
SOIC
D
TSSOP
TSSOP
SOIC
PW
PW
D
LM324MTX/NOPB
LM324MX
LM324MX/NOPB
SOIC
D
Pack Materials-Page 2