SNOSB38B – JANUARY 2009 – REVISED APRIL 2013
(1) (2)
ABSOLUTE MAXIMUM RATINGS
VIN to GND
EN, FB, VCON, SW
Continuous Power Dissipation
(3)
−0.2V
to +6.0V
(GND−0.2V) to (VIN+0.2V) w/ 6.0V
Internally Limited
+150°C
−65°C
to +150°C
+260°C
2kV
1250V
Junction Temperature (T
J-MAX
)
Storage Temperature Range
Maximum Lead Temperature
(Soldering, 10 sec)
ESD Rating
(4)
Human Body Model:
Charged Device Model:
(1)
(2)
(3)
(4)
Stresses beyond those listed under
absolute maximum ratings
may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under
recommended operating
conditions
is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
All voltages are with respect to the potential at the GND pins.
Internal thermal shutdown circuitry protects the device from permanent damage. Thermal shutdown engages at T
J
= 150°C (typ.) and
disengages at T
J
= 125°C (typ.).
The Human body model is a 100 pF capacitor discharged through a 1.5 kΩ resistor into each pin. (MIL-STD-883 3015.7)
(1) (2)
OPERATING RATINGS
Input Voltage Range
Recommended Load Current
2.7V to 5.5V
0mA to 750 mA
−30°C
to +125°C
−30°C
to +85°C
Junction Temperature (T
J
) Range
Ambient Temperature (T
A
) Range
(3)
(1)
(2)
(3)
Stresses beyond those listed under
absolute maximum ratings
may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under
recommended operating
conditions
is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
All voltages are with respect to the potential at the GND pins.
In applications where high power dissipation and/or poor package thermal resistance is present, the maximum ambient temperature may
have to be de-rated. Maximum ambient temperature (T
A-MAX
) is dependent on the maximum operating junction temperature (T
J-MAX-OP
=
125°C), the maximum power dissipation of the device in the application (P
D-MAX
), and the junction-to ambient thermal resistance of the
part/package in the application (θ
JA
), as given by the following equation: T
A-MAX
= T
J-MAX-OP
– (θ
JA
× P
D-MAX
).
THERMAL PROPERTIES
Junction-to-Ambient Thermal Resistance (θ
JA
), YZR06 Package
(1)
(1)
85°C/W
Junction-to-ambient thermal resistance (θ
JA
) is taken from a thermal modeling result, performed under the conditions and guidelines set
forth in the JEDEC standard JESD51-7.
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