LM3241
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SNOSB38B –JANUARY 2009–REVISED APRIL 2013
(1) (2)
ABSOLUTE MAXIMUM RATINGS
VIN to GND
−0.2V to +6.0V
(GND−0.2V) to (VIN+0.2V) w/ 6.0V
Internally Limited
EN, FB, VCON, SW
Continuous Power Dissipation
(3)
Junction Temperature (TJ-MAX
Storage Temperature Range
)
+150°C
−65°C to +150°C
Maximum Lead Temperature
(Soldering, 10 sec)
+260°C
(4)
ESD Rating
Human Body Model:
2kV
Charged Device Model:
1250V
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltages are with respect to the potential at the GND pins.
(3) Internal thermal shutdown circuitry protects the device from permanent damage. Thermal shutdown engages at TJ = 150°C (typ.) and
disengages at TJ = 125°C (typ.).
(4) The Human body model is a 100 pF capacitor discharged through a 1.5 kΩ resistor into each pin. (MIL-STD-883 3015.7)
(1) (2)
OPERATING RATINGS
Input Voltage Range
2.7V to 5.5V
0mA to 750 mA
−30°C to +125°C
−30°C to +85°C
Recommended Load Current
Junction Temperature (TJ) Range
Ambient Temperature (TA) Range
(3)
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltages are with respect to the potential at the GND pins.
(3) In applications where high power dissipation and/or poor package thermal resistance is present, the maximum ambient temperature may
have to be de-rated. Maximum ambient temperature (TA-MAX) is dependent on the maximum operating junction temperature (TJ-MAX-OP
125°C), the maximum power dissipation of the device in the application (PD-MAX), and the junction-to ambient thermal resistance of the
part/package in the application (θJA), as given by the following equation: TA-MAX = TJ-MAX-OP – (θJA × PD-MAX).
=
THERMAL PROPERTIES
(1)
Junction-to-Ambient Thermal Resistance (θJA), YZR06 Package
85°C/W
(1) Junction-to-ambient thermal resistance (θJA) is taken from a thermal modeling result, performed under the conditions and guidelines set
forth in the JEDEC standard JESD51-7.
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