3-TERMINAL ADJUSTABLE REGULATOR
SLVS044R – SEPTEMBER 1997 – REVISED APRIL 2007
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SCHEMATIC DIAGRAM
INPUT
OUTPUT
ADJUST
Absolute Maximum Ratings
(1)
over virtual junction temperature range (unless otherwise noted)
MIN
V
I
– V
O
T
J
T
stg
(1)
Input-to-output differential voltage
Operating virtual junction temperature
Lead temperature 1,6 mm (1/16 in) from case for 10 s
Storage temperature range
–65
MAX
40
150
260
150
UNIT
V
°C
°C
°C
Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
Package Thermal Data
(1)
PACKAGE
PowerFLEX™ (KTE)
SOT-223 (DCY)
TO-220 (KC/KCS)
TO-263 (KTT)
(1)
(2)
BOARD
High K, JESD 51-5
High K, JESD 51-7
High K, JESD 51-5
High K, JESD 51-5
θ
JA
23°C/W
53°C/W
19°C/W
25.3°C/W
θ
JC
3°C/W
30.6°C/W
17°C/W
18°C/W
3°C/W
1.94°C/W
θ
JP (2)
Maximum power dissipation is a function of T
J
(max),
θ
JA
, and T
A
. The maximum allowable power dissipation at any allowable ambient
temperature is P
D
= (T
J
(max) – T
A
)/θ
JA
. Operating at the absolute maximum T
J
of 150°C can affect reliability.
For packages with exposed thermal pads, such as QFN, PowerPAD™, or PowerFLEX™,
θ
JP
is defined as the thermal resistance
between the die junction and the bottom of the exposed pad.
2
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