SNVS774O – MAY 2004 – REVISED JANUARY 2014
LM317A and LM317-N ELECTRICAL CHARACTERISTICS
(1)
Specifications with standard type face are for T
J
= 25°C, and those with
boldface type
apply over
full Operating
Temperature Range.
Unless otherwise specified, V
IN
−
V
OUT
= 5V, and I
OUT
= 10 mA.
LM317A
Parameter
Conditions
Min
1.238
Reference Voltage
3V
≤
(V
IN
−
V
OUT
)
≤
40V,
10 mA
≤
I
OUT
≤
I
MAX (1)
3V
≤
(V
IN
−
V
OUT
)
≤
40V
10 mA
≤
I
OUT
≤
I
MAX (1)
20 ms Pulse
10 mA
≤
I
OUT
≤
I
MAX (1)
3V
≤
(V
IN
−
V
OUT
)
≤
40V
T
MIN
≤
T
J
≤
T
MAX
(V
IN
−
V
OUT
) = 40V
NDS, KTT Packages
(V
IN
−
V
OUT
)
≤
15V
Current Limit
(V
IN
−
V
OUT
) = 40V
RMS Output Noise, % of
V
OUT
Ripple Rejection Ratio
Long-Term Stability
DCY, NDE Packages
NDT Package
NDS, KTT Packages
DCY, NDE Packages
NDT Package
10 Hz
≤
f
≤
10 kHz
V
OUT
= 10V, f = 120 Hz, C
ADJ
= 0
μF
V
OUT
= 10V, f = 120 Hz, C
ADJ
= 10
μF
T
J
= 125°C, 1000 hrs
NDS (TO-3) Package
NDE (TO-220) Package
Thermal Resistance,
θ
JC
Junction-to-Case
KTT (TO-263) Package
DCY (SOT-223) Package
NDT (TO) Package
NDP (TO-252) Package
NDS (TO-3) Package
NDE (TO-220) Package
Thermal Resistance,
θ
JA
Junction-to-Ambient
(No Heat Sink)
KTT (TO-263) Package
NDT (TO) Package
NDP (TO-252) Package
(1)
(3)
(3)
(3)
(2)
LM317-N
Max
1.262
1.270
0.01
0.02
0.5
1
0.07
100
5
Min
-
1.20
Typ
1.25
1.25
0.01
0.02
0.1
0.3
0.04
50
0.2
1
10
-
3.4
1.8
1.5
1.5
0.5
0.15
0.15
0.075
3.5
2.2
2.2
0.8
0.40
0.40
0.20
0.003
65
66
1
80
0.3
2
4
4
23.5
21
12
39
50
50
140
186
103
°C/W
°C/W
1
%
dB
dB
%
A
10
3.4
3.4
1.8
A
Max
-
1.30
0.04
0.07
0.5
1.5
0.07
100
5
Unit
s
V
V
%/V
%
%/W
μA
μA
%
mA
Typ
1.250
1.250
0.005
0.01
0.1
0.3
0.04
50
0.2
1
3.5
1.225
Line Regulation
Load Regulation
Thermal Regulation
Adjustment Pin Current
Adjustment Pin Current
Change
Temperature Stability
Minimum Load Current
(2)
-
1.5
0.5
-
0.15
0.075
-
2.2
0.8
-
0.40
0.20
0.003
65
66
80
0.3
-
4
-
23.5
21
12
-
50
-
140
186
103
DCY (SOT-223) Package
(2)
(3)
I
MAX
= 1.5A for the NDS (TO-3), NDE (TO-220), and KTT (TO-263) packages. I
MAX
= 1.0A for the DCY (SOT-223) package. I
MAX
= 0.5A
for the NDT (TO) and NDP (TO-252) packages. Device power dissipation (P
D
) is limited by ambient temperature (T
A
), device maximum
junction temperature (T
J
), and package thermal resistance (θ
JA
). The maximum allowable power dissipation at any temperature is :
P
D(MAX)
= ((T
J(MAX)
- T
A
)/θ
JA
). All Min. and Max. limits are ensured to TI's Average Outgoing Quality Level (AOQL).
Regulation is measured at a constant junction temperature, using pulse testing with a low duty cycle. Changes in output voltage due to
heating effects are covered under the specifications for thermal regulation.
When surface mount packages are used (TO-263, SOT-223, TO-252), the junction to ambient thermal resistance can be reduced by
increasing the PC board copper area that is thermally connected to the package. See the
section for heatsink
techniques.
6
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