LM117, LM317-N
SNVS774L –MAY 2004–REVISED FEBRUARY 2011
www.ti.com
LM317A and LM317-N Electrical Characteristics(1) (continued)
Specifications with standard type face are for TJ = 25°C, and those with boldface type apply over full Operating
Temperature Range. Unless otherwise specified, VIN − VOUT = 5V, and IOUT = 10 mA.
LM317A
LM317-N
Typ
2
Parameter
Conditions
Min
Typ
-
Max
Min
Max
Units
NDS (TO-3) Package
NDE (TO-220) Package
KTT (TO-263) Package
DCY (SOT-223) Package
NDT (TO) Package
4
4
-
4
Thermal Resistance, θJC
Junction-to-Case
°C/W
23.5
21
12
-
23.5
21
MDT (PFM) Package
NDS (TO-3) Package
NDE (TO-220) Package
12
39
50
-
50
(3)
Thermal Resistance, θJA
Junction-to-Ambient (No
Heat Sink)
KTT (TO-263) Package
DCY (SOT-223) Package
NDT (TO) Package
50
°C/W
(3)
140
186
103
140
186
103
(3)
MDT (PFM) Package
(3) When surface mount packages are used (TO-263, SOT-223, PFM), the junction to ambient thermal resistance can be reduced by
increasing the PC board copper area that is thermally connected to the package. See the Applications Hints section for heatsink
techniques.
6
Submit Documentation Feedback
Copyright © 2004–2011, Texas Instruments Incorporated
Product Folder Links: LM117 LM317-N
TI [ TEXAS INSTRUMENTS ]
