LM111, LM211, LM311, LM311Y
DIFFERENTIAL COMPARATORS WITH STROBES
SLCS007A – SEPTEMBER 1973 – REVISED FEBRUARY 1992
LM311Y chip information
This chip, when properly assembled, displays characteristics similar to the LM311. Thermal compression or
ultrasonic bonding may be used on the doped-aluminum bonding pads. Chips may be mounted with conductive
epoxy or a gold-silicon preform.
BONDING PAD ASSIGNMENTS
(1)
(8)
COL
OUT
V
CC+
(8)
(5)
(7)
BALANCE
(7)
(2)
(3)
IN+
IN–
+
–
(2)
(6)
BAL/STRB
(4)
(1)
EMIT
62
V
CC–
OUT
(3)
CHIP THICKNESS: 15 TYPICAL
BONDING PADS: 4 × 4 MINIMUM
(4)
(5)
(6)
T
J
max = 150°C
TOLERANCES ARE ±10%.
50
ALL DIMENSIONS ARE IN MILS.
3
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TI [ TEXAS INSTRUMENTS ]
