PACKAGE OPTION ADDENDUM
www.ti.com
1-Nov-2013
PACKAGING INFORMATION
Orderable Device
Status Package Type Package Pins Package
Eco Plan
Lead/Ball Finish
MSL Peak Temp
Op Temp (°C)
Device Marking
Samples
Drawing
Qty
(1)
(2)
(6)
(3)
(4/5)
LM111H
ACTIVE
TO-99
TO-99
LMC
8
8
500
TBD
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-55 to 125
-55 to 125
LM111H
LM111H/NOPB
ACTIVE
LMC
500
Green (RoHS
& no Sb/Br)
POST-PLATE
Level-1-NA-UNLIM
LM111H
LM111J-8
LM311H
ACTIVE
ACTIVE
ACTIVE
CDIP
TO-99
TO-99
NAB
LMC
LMC
8
8
8
40
TBD
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-55 to 125
0 to 70
LM111J-8
LM311H
LM311H
500
500
TBD
LM311H/NOPB
Green (RoHS
& no Sb/Br)
POST-PLATE
Level-1-NA-UNLIM
0 to 70
LM311M
LM311M/NOPB
LM311MX
NRND
ACTIVE
NRND
SOIC
SOIC
SOIC
SOIC
PDIP
PDIP
PDIP
D
D
D
D
P
P
P
8
8
8
8
8
8
8
95
95
TBD
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CU SN
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Level-1-260C-UNLIM
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0 to 70
0 to 70
0 to 70
0 to 70
0 to 70
0 to 70
0 to 70
LM
311M
Green (RoHS
& no Sb/Br)
LM
311M
2500
2500
40
TBD
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LM
311M
LM311MX/NOPB
LM311N
ACTIVE
NRND
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
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LM
311M
TBD
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LM
311N
LM311N/NOPB
MLM311P
ACTIVE
NRND
40
Green (RoHS
& no Sb/Br)
SN | CU SN
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Level-1-NA-UNLIM
Call TI
LM
311N
40
TBD
LM
311N
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Addendum-Page 1
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