PACKAGE OPTION ADDENDUM
www.ti.com
4-Mar-2005
Orderable Device
Status (1)
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
PDIP
SOIC
Drawing
LM2904QP
OBSOLETE
ACTIVE
P
D
8
8
None
Call TI
Call TI
LM2904VQDR
2500
Pb-Free
(RoHS)
CU NIPDAU Level-2-250C-1 YEAR/
Level-1-235C-UNLIM
LM2904VQPWR
LM358AD
ACTIVE
ACTIVE
TSSOP
SOIC
PW
D
8
8
2000
75
None
CU NIPDAU Level-1-250C-UNLIM
Pb-Free
(RoHS)
CU NIPDAU Level-2-260C-1 YEAR/
Level-1-235C-UNLIM
LM358ADGKR
LM358ADR
LM358AP
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
MSOP
SOIC
DGK
D
8
8
8
8
8
8
8
8
8
2500 Green (RoHS & CU NIPDAU Level-2-260C-1YEAR
no Sb/Br)
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
PDIP
P
50
Pb-Free
(RoHS)
CU NIPDAU Level-NC-NC-NC
CU NIPDAU Level-1-250C-UNLIM
CU NIPDAU Level-1-250C-UNLIM
LM358APW
LM358APWR
LM358D
TSSOP
TSSOP
SOIC
PW
PW
D
150
Pb-Free
(RoHS)
2000
Pb-Free
(RoHS)
75 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
LM358DGKR
LM358DR
MSOP
SOIC
DGK
D
2500 Green (RoHS & CU NIPDAU Level-2-260C-1YEAR
no Sb/Br)
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
LM358P
PDIP
P
50
Pb-Free
(RoHS)
CU NIPDAU Level-NC-NC-NC
LM358PSLE
LM358PSR
OBSOLETE
ACTIVE
SO
SO
PS
PS
8
8
None
Call TI Call TI
2000
150
Pb-Free
(RoHS)
CU NIPDAU Level-2-260C-1 YEAR/
Level-1-235C-UNLIM
LM358PW
ACTIVE
TSSOP
PW
8
Pb-Free
(RoHS)
CU NIPDAU Level-1-250C-UNLIM
LM358PWLE
LM358PWR
OBSOLETE TSSOP
ACTIVE TSSOP
PW
PW
8
8
None
Call TI
Call TI
2000
Pb-Free
(RoHS)
CU NIPDAU Level-1-250C-UNLIM
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - May not be currently available - please check http://www.ti.com/productcontent for the latest availability information and additional
product content details.
None: Not yet available Lead (Pb-Free).
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Green (RoHS & no Sb/Br): TI defines "Green" to mean "Pb-Free" and in addition, uses package materials that do not contain halogens,
including bromine (Br) or antimony (Sb) above 0.1% of total product weight.
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDECindustry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
Addendum-Page 2
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